Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Walsin 0603B331K500CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- (Walsin) 0603B331K500CT
- Type
- WALSIN
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 0603B331K500CT
- Electronic Component
- 1
- Electronic Component
- 330pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265428853
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0603B331K500CT - 华新科陶瓷电容器
引言
0603B331K500CT是一款高性能的多层陶瓷电容器（MLCC），由华新科（Walsin）制造。该产品在电子电路设计中具有广泛的应用，尤其适合需要高频、高稳定性和高可靠性的通用电子设备。随着现代电子产品对小型化、轻量化和高密度设计的需求日益增加，0603系列封装的电容器逐渐成为核心元件之一。
主要参数
- 电容值：330pF
- 温度系数：X7R
- 容差：±10%
- 工作温度范围：-55°C ~ 125°C
- 额定电压：50V
- 封装尺寸：0603（1.60mm x 0.80mm）
- 厚度（最大值）：0.034"（0.87mm）
- 安装类型：表面贴装
电容器类型与特性
0603B331K500CT采用X7R温度系数，这意味着它的电容值在较宽的温度范围内保持相对稳定。X7R材料的特点在于其高介电常数和良好的温度特性，使其在不同的环境条件下都能提供一致的性能。该电容器具有±10%的容差，适合高要求的应用场景，如 RF 设备、通信系统、音频设备等。
应用场景
0603B331K500CT电容器广泛应用于各种电子产品中，包括但不限于：
- 消费电子：如智能手机、平板电脑、便携式音响等，要求元件体积小、稳定性好。
- 汽车电子：在汽车电子控制单元中，电容器需要稳定的电气性能以保证汽车安全性与性能。
- 工业设备：在高温、湿度等恶劣环境下运行的工业设备中，该电容器可保证设备的耐久性与稳定性。
- 医疗设备：电子医疗设备对组件的可靠性有着极高的要求，0603B331K500CT的设计能够满足这些严格标准。
封装与安装
该电容器采用0603封装，这是当前最普遍的表面贴装组件之一。0603封装的优势在于其小型化设计，不仅节省了电路板的空间，还使得高密度布线成为可能。表面贴装技术（SMT）进一步简化了安装过程，提升了制造效率和可靠性。
结论
0603B331K500CT是一款功能强大、性能卓越的陶瓷电容器，在不同的应用场景中表现优异。凭借其高稳定性、高可靠性和紧凑的体积，0603B331K500CT正成为现代电子设计中不可或缺的元件之一。无论是在消费电子、汽车电子、工业控制还是医疗设备中，它都能够为设计师提供灵活的解决方案，并满足日益增长的市场需求。
如您在设计中需要选择合适的陶瓷电容器，0603B331K500CT无疑是一个值得考虑的选择，其可靠的性能与广泛的应用潜力将为您的项目成功提供保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
