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Walsin 0805B225K250CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- (Walsin) 0805B225K250CT
- Type
- WALSIN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 0805B225K250CT
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0265428860
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805B225K250CT 片式陶瓷电容产品概述
一、产品基本信息
0805B225K250CT是华新科（Walsin） 推出的高性能片式陶瓷电容，属于X7R材质系列。该型号采用行业标准0805封装（英制：0.08″×0.05″，公制：2.0mm×1.25mm），专为表面贴装工艺设计，适配各类小型化电子设备的电路集成需求。
二、核心电气性能参数
该电容核心参数清晰，满足多数中低压电路的基础功能：
- 容值：2.2μF（料号“225”对应22×10⁵pF=2.2μF）；
- 精度：±10%（料号“K”为精度代码）；
- 额定电压：25VDC（料号“250”表示25V直流额定电压）；
- 温度特性：X7R材质（EIA标准），工作温度范围-55℃~+125℃，容值变化率≤±15%；
- 损耗角正切：1kHz/25℃条件下≤2.5%（具体参考华新科官方 datasheet）。
三、封装与物理特性
0805封装是该电容的关键物理特征，适配高密度PCB布局：
- 尺寸规格：典型尺寸2.0mm（长）×1.25mm（宽）×0.85mm（厚），无引脚设计，通过两端电极焊接；
- 电极材料：镍电极（Ni）+无铅镀层（符合RoHS），确保焊接可靠性与环保合规；
- 耐焊接性：可承受260℃回流焊温度（适配常规SMT生产工艺）。
四、典型应用场景
基于X7R稳定性与0805小型化优势，该电容广泛用于：
- 消费电子：智能手机、平板、笔记本的电源滤波、信号耦合；
- 智能家居：智能音箱、路由器、安防摄像头的中低压去耦；
- 工业控制：小型PLC、传感器模块的信号调理；
- 通信设备：4G/5G基站模块、无线AP的射频耦合与滤波。
五、产品优势与特点
该型号具备以下实用优势：
- 容值稳定：X7R材质容值随温度、电压变化小，优于Y5V等材质，适合对稳定性要求较高的电路；
- 小型化适配：0805封装体积小，降低PCB空间占用，满足设备轻薄化需求；
- 高可靠性：华新科产品经温度循环、湿度老化等严格测试，适合长期稳定工作；
- 环保合规：无铅镀层符合RoHS、REACH法规，适配绿色产品设计。
六、选型与使用注意事项
为确保性能与可靠性，需注意：
- 电压降额：实际工作电压≤20VDC（80%额定电压），避免过压损坏；
- 温度范围：确认环境温度在-55℃~+125℃内，超出可能导致容值漂移；
- 精度匹配：±10%精度满足多数滤波需求，若需更高精度（如±5%）需更换型号；
- 焊盘设计：PCB焊盘尺寸匹配0805标准（典型：长1.0mm×宽0.8mm），避免虚焊、桥接。
该电容是中低压电路中平衡性能、体积与成本的实用选择，广泛适配各类消费电子与工业级小型设备。
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