WMSIC Electronic Components

Walsin 0603B103K101CT

Model0603B103K101CT
Package0603
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
(Walsin) 0603B103K101CT
Type
WALSIN
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0603B103K101CT
Electronic Component
1
Electronic Component
10nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264349454
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0603B103K101CT陶瓷电容产品概述

华新科(Walsin)0603B103K101CT是一款通用型多层陶瓷电容(MLCC),采用0603英制封装(对应公制1608规格),核心参数适配中等电压、宽温环境下的电子电路需求,广泛应用于消费电子、工业控制等领域。

一、产品型号与核心参数解读

该型号各字符对应明确的技术参数,具体拆解如下:

  • 0603:英制封装代码,对应公制尺寸1608(长1.6mm×宽0.8mm);
  • B:华新科通用型MLCC系列标识;
  • 103:容值编码,10×10³pF=10nF(10000pF);
  • K:精度等级,±10%;
  • 101:额定电压编码,10×10¹V=100V(直流/交流有效值);
  • CT:后缀标识,代表无极性、标准无铅环保规格。

核心参数汇总:

参数项 规格值 容值 10nF(10000pF) 精度 ±10% 额定电压 100V(DC/AC) 温度系数 X7R(-55℃~+125℃) 封装 0603英制(1608公制) 环保认证 RoHS、REACH compliant

二、关键性能特性

  1. 宽温稳定性:X7R温度系数保证产品在-55℃至+125℃范围内,容量变化≤±15%,避免因环境温度波动导致电路性能漂移,适配工业、车载(非AEC-Q200级)等宽温场景;
  2. 中等电压耐受:100V额定电压覆盖常见24V、48V工业电源及部分高压信号电路,无需过度降额即可稳定工作;
  3. 小体积高密度:0603封装体积仅1.6mm×0.8mm×0.8mm(典型值),适合智能手机、机顶盒等小型化电子设备的高密度PCB布局;
  4. 低损耗特性:1kHz频率下损耗角正切值≤0.015,适合射频信号耦合、去耦等低损耗需求场景;
  5. 无极性设计:无需区分正负极,焊接工艺简单,降低生产出错率。

三、封装与物理规格

华新科0603封装的具体物理参数(典型值):

  • 长度:1.6±0.15mm;
  • 宽度:0.8±0.15mm;
  • 厚度:0.8±0.1mm;
  • 电极端宽度:0.3±0.1mm;
  • 电极端伸出量:0.1~0.3mm;
  • 单个重量:约0.01g。

封装采用无铅锡电极(Sn-Pb-free),符合欧盟RoHS 2.0及REACH法规要求,环保且兼容现代焊接工艺。

四、典型应用场景

  1. 电源滤波电路:
    • 工业24V/48V电源模块的输入/输出滤波,抑制纹波噪声;
    • 消费电子(电视、路由器)的5V/12V电源端去耦,稳定电压输出;
  2. 信号耦合与去耦:
    • 射频前端(WiFi、蓝牙模块)的小信号耦合电容,减少信号串扰;
    • 数字电路(MCU、FPGA)的电源去耦,降低电源噪声对信号的干扰;
  3. 工业控制电路:
    • 传感器模块的信号滤波,适配-20℃~+85℃的工业环境;
    • 小型PLC的I/O接口滤波,提升信号稳定性;
  4. 消费电子终端:
    • 智能手机、智能手表的音频电路耦合,体积小不占用过多空间;
    • 机顶盒、游戏机的电源板去耦,满足小型化设计需求。

五、应用注意事项

  1. 电压降额建议:实际工作电压建议不超过额定电压的80%(即≤80V),延长产品寿命并避免击穿风险;
  2. 焊接工艺要求:
    • 回流焊:峰值温度245±5℃,时间≤10秒(符合J-STD-020标准);
    • 波峰焊:温度250±5℃,时间≤3秒;
    • 手工焊:温度350±10℃,时间≤2秒;
  3. 机械应力控制:焊接后避免PCB过度弯曲(弯曲半径≥20mm),防止电容内部开裂;
  4. 温度限制:工作温度不得超过125℃,存储温度≤150℃(短期);
  5. 静电防护:操作时需佩戴防静电手环/手套,避免静电击穿(MLCC易受静电损坏)。

六、品牌与可靠性说明

华新科作为全球前五大MLCC制造商之一,0603B103K101CT通过以下可靠性测试:

  • 高温存储测试(125℃,1000小时):容量变化≤±5%,绝缘电阻≥10⁹Ω;
  • 温度循环测试(-55℃~+125℃,1000次循环):无开裂、容量变化≤±10%;
  • 湿度测试(85℃/85%RH,1000小时):绝缘电阻≥10⁸Ω;
  • 耐焊接热测试:符合J-STD-020标准,无外观损坏。

产品符合ISO 9001质量管理体系及ISO/TS 16949汽车行业标准(部分批次),可靠性满足工业级应用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.