WMSIC Electronic Components

Walsin 0603B224K250CT

Model0603B224K250CT
Package0603
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0603B224K250CT
Type
WALSIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0603B224K250CT
Electronic Component
1
Electronic Component
220nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264549878
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0603B224K250CT陶瓷电容器产品概述

一、产品基本信息

华新科0603B224K250CT是一款通用型多层陶瓷电容器(MLCC),由台湾华新科(Walsin)出品,型号命名遵循行业标准:

  • 0603:英制封装尺寸(对应公制1608,即1.6mm×0.8mm);
  • B:产品系列标识(适配中低压通用场景);
  • 224:容值代码(22×10⁴pF=220nF);
  • K:精度等级(±10%);
  • 250:额定电压标识(25V,数值×0.1V换算);
  • CT:端接细节(无铅锡银铜端电极,符合环保标准)。

二、核心性能参数解析

该产品参数针对性强,适配中低压电路的主流需求:

  1. 容值与精度:标称220nF,±10%精度,满足电源滤波、信号耦合的偏差要求,无需额外校准;
  2. 额定电压:25V直流额定电压,实际应用需留20%安全余量(建议电路电压≤20V),避免过压击穿;
  3. 温度系数:采用X7R特性,工作温度范围**-55℃至+125℃**,此范围内容值变化≤±15%——相比Y5V(容值波动可达+80%)稳定性更优,可适应高温或温度波动场景(如车载辅助电路)。

三、封装与物理特性

0603封装是小型化设备的主流选择,物理特性如下:

  • 尺寸:英制0603(1.6mm长×0.8mm宽),公制1608,厚度通常为0.5mm(批次偏差±0.05mm);
  • 端接设计:无铅Sn-Ag-Cu端电极,符合欧盟RoHS、中国RoHS及REACH指令,兼容回流焊、波峰焊工艺;
  • 贴装兼容性:焊盘间距与PCB匹配,可实现高密度贴装(每平方厘米贴装数十颗),适配手机、智能穿戴等紧凑设计。

四、适用场景与应用优势

该产品覆盖三类核心场景,具备明显性价比优势:

  1. 消费电子:手机主板电源滤波、平板触控屏信号耦合、蓝牙耳机充电电路去耦——小型化封装适配便携设备;
  2. 智能家居:智能插座、温湿度传感器信号调理——X7R稳定性适应家庭温度(0℃~40℃);
  3. 小型工业控制:PLC输入输出模块抗干扰滤波——25V电压满足低中压工业需求。

核心优势:

  • 平衡“稳定性”与“成本”:比NP0/C0G(高精度但价高)便宜30%,比Y5V(价低但波动大)更可靠;
  • 批量适配:华新科自动化产线一致性好,适合大规模SMT贴装;
  • 环保合规:无铅端电极满足全球出口要求,无需额外认证调整。

五、质量与可靠性说明

华新科作为全球MLCC主要供应商,该产品通过多项认证:

  • 资质认证:ISO 9001(质量)、ISO 14001(环境);
  • 可靠性测试:经125℃/1000小时老化、-55℃~+125℃/1000次循环测试,容值变化≤±5%,25V下漏电流≤1μA;
  • 端电极附着力:满足JESD22-B102标准,1.5m跌落测试无脱落,适配移动设备抗摔需求。

六、选型匹配参考

若需替换或扩展,需注意以下要点:

  1. 电压升级:电路30V选0603B224K500CT(50V),避免过压;
  2. 温度升级:环境超125℃(如高温传感器)选X8R(-55℃~+150℃);
  3. 精度升级:需±5%选“J”档(如0603B224J250CT),成本增10%;
  4. 容值调整:需100nF选0603B104K250CT,容值减半价降5%。

该产品是中低压通用电路的高性价比选择,适配小型化、温度波动场景的核心需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.