WMSIC Electronic Components

Walsin 0805X106K100CT

Model0805X106K100CT
Package0805
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0805X106K100CT
Type
WALSIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0805X106K100CT
Electronic Component
1
Electronic Component
10uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0264992287
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0805X106K100CT陶瓷电容器产品概述

一、产品核心参数与编码解析

华新科0805X106K100CT是一款多层陶瓷电容器(MLCC),核心参数清晰明确,编码可直观对应技术指标:

参数类别 具体指标 编码解析说明 容值 10μF 106(10×10⁶ pF=10μF) 精度 ±10% K(EIA精度标识) 额定电压 10V DC 100(电压编码) 温度系数 X5R(EIA标准) X前缀+温度范围标识 封装规格 0805(英制)/2012(公制) 封装尺寸代码 品牌 华新科(Walsin) 台系主流无源器件厂商

其中X5R温度特性是核心亮点:EIA定义为「-55℃至+85℃环境下,容量变化率≤±15%」,兼顾容量稳定性与高容值密度,优于Y5V(容量变化可达+22%/-82%),适合对容量波动敏感的电路。

二、封装与物理特性

0805封装(公制2012)是电子设备小型化的主流选择,物理尺寸紧凑:

  • 英制:0.08英寸(长)×0.05英寸(宽);
  • 公制:2.0mm(长)×1.2mm(宽);
  • 典型厚度:约1.0mm(具体参考华新科 datasheet)。

该封装兼容所有标准SMT贴装设备,可高密度布局在PCB上,满足智能手机、智能穿戴等紧凑产品的空间需求——例如手机主板CPU供电模块的密集去耦电容阵列。

三、材料特性与性能优势

1. X5R介质的核心价值

  • 容量稳定性:比Y5V更稳定,适合电源滤波、信号耦合等需要稳定阻抗的场景;
  • 高容值密度:在0805小封装下实现10μF容值,远高于C0G(低容值、高稳定)系列;
  • 低损耗:DF(损耗因子)≤1.0%(1kHz),减少信号传输中的能量损耗。

2. 华新科工艺优势

  • 低ESR/ESL:ESR典型值≤10mΩ(1kHz),ESL≤1nH,提升高频滤波效果(如抑制CPU瞬态电流波动);
  • 环保无铅:符合RoHS 2.0、REACH标准,满足全球市场准入;
  • 高可靠性:经过「-55℃~+85℃ 1000次温度循环」「85℃/85%RH 1000h湿度测试」等验证,失效率低。

四、典型应用场景

该产品因「小体积+高容值+稳定特性」,广泛覆盖以下领域:

  1. 消费电子终端:智能手机CPU供电去耦、蓝牙耳机音频耦合、智能手环电池滤波;
  2. 小型家电:遥控器电源稳压、智能灯泡驱动滤波;
  3. 物联网设备:传感器节点电源去噪、低功耗通信模块信号滤波;
  4. 汽车辅助电子:车载USB充电器滤波、车载蓝牙模块信号耦合(非高可靠性场景)。

实际案例:在智能手机LDO(低压差稳压器)输出端,该电容并联使用可快速吸收瞬态电流,避免电压跌落导致芯片卡顿;在蓝牙耳机音频解码芯片输入侧,作为耦合电容实现低损耗信号传输。

五、选型与使用注意事项

  1. 电压余量设计:实际工作电压≤8V(额定电压的80%),避免过压击穿;
  2. 温度限制:环境温度不超过+85℃,禁止在高温场景(如烤箱、工业炉附近)使用;
  3. 焊接工艺:回流焊峰值温度240℃~260℃,回流时间≤60s,避免热应力开裂;
  4. 存储要求:未开封产品存于25℃±5℃、40%~60%湿度环境,开封后1年内使用完毕;
  5. 极性说明:无极性设计,正反任意贴装(区别于电解电容)。

六、总结

华新科0805X106K100CT是一款高性价比的小型化MLCC,凭借X5R的稳定特性、0805封装的紧凑尺寸及华新科的可靠工艺,成为消费电子、便携式设备的核心无源器件。其低损耗、环保无铅及高可靠性,完美匹配现代电子设备对「性能、成本、空间」的综合需求,是工程师电源滤波、信号耦合设计的实用选择。

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