Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
华新科0805X106K100CT是一款多层陶瓷电容器(MLCC),核心参数清晰明确,编码可直观对应技术指标:
参数类别 具体指标 编码解析说明 容值 10μF 106(10×10⁶ pF=10μF) 精度 ±10% K(EIA精度标识) 额定电压 10V DC 100(电压编码) 温度系数 X5R(EIA标准) X前缀+温度范围标识 封装规格 0805(英制)/2012(公制) 封装尺寸代码 品牌 华新科(Walsin) 台系主流无源器件厂商其中X5R温度特性是核心亮点:EIA定义为「-55℃至+85℃环境下,容量变化率≤±15%」,兼顾容量稳定性与高容值密度,优于Y5V(容量变化可达+22%/-82%),适合对容量波动敏感的电路。
0805封装(公制2012)是电子设备小型化的主流选择,物理尺寸紧凑:
该封装兼容所有标准SMT贴装设备,可高密度布局在PCB上,满足智能手机、智能穿戴等紧凑产品的空间需求——例如手机主板CPU供电模块的密集去耦电容阵列。
该产品因「小体积+高容值+稳定特性」,广泛覆盖以下领域:
实际案例:在智能手机LDO(低压差稳压器)输出端,该电容并联使用可快速吸收瞬态电流,避免电压跌落导致芯片卡顿;在蓝牙耳机音频解码芯片输入侧,作为耦合电容实现低损耗信号传输。
华新科0805X106K100CT是一款高性价比的小型化MLCC,凭借X5R的稳定特性、0805封装的紧凑尺寸及华新科的可靠工艺,成为消费电子、便携式设备的核心无源器件。其低损耗、环保无铅及高可靠性,完美匹配现代电子设备对「性能、成本、空间」的综合需求,是工程师电源滤波、信号耦合设计的实用选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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