WMSIC Electronic Components

Walsin 1210B106K500CT

Model1210B106K500CT
Package1210
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

16 specifications

Core information

Product name
(Walsin) 1210B106K500CT
Type
WALSIN
Minimum package
1000

Technical parameters

Electronic Component
(WALSIN)
Electronic Component
1210B106K500CT
Electronic Component
1
Electronic Component
10uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0227664289
Electronic Component
X7R
Voltage
50V
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科1210B106K500CT 片式陶瓷电容产品概述

一、产品基本信息

华新科(Walsin)1210B106K500CT是一款X7R温度特性的表面贴装陶瓷电容,核心参数与封装信息明确:

  • 品牌:华新科(Walsin)
  • 型号:1210B106K500CT
  • 封装:1210(英制尺寸:3.2mm×2.5mm,公制对应3225)
  • 容值:10μF(型号中“106”为编码:10×10⁶ pF)
  • 精度:±10%(型号中“K”为精度标识)
  • 额定电压:50V(型号中“500”为电压编码)
  • 温度系数:X7R(-55℃~+125℃范围内容量变化≤±15%)

二、关键技术参数详解

1. 容量与精度

容值10μF为中容量陶瓷电容,±10%精度满足大多数通用电路需求(无需超高精度的滤波、耦合场景),避免了高精度型号的成本增加。

2. 温度特性(X7R)

X7R是陶瓷电容中宽温稳定型代表:

  • 工作温度范围:-55℃~+125℃(覆盖工业、汽车电子等严苛环境)
  • 容量变化:温度范围内≤±15%,比Y5V(容量变化±20%~-80%)更稳定,比NPO(高精度但容量小)更适合大容量需求。

3. 额定电压与封装

50V额定电压适用于低压直流/脉冲电路(如DC-DC输出、IC电源引脚),需注意实际工作电压建议不超过40V(80%降额,延长寿命);1210封装体积小,兼容主流SMT(表面贴装)工艺,支持回流焊、波峰焊,适配自动化生产。

三、核心特性优势

  1. 宽温可靠性:X7R特性使其在极端温度下仍保持稳定容量,适合户外设备、工业控制器等场景;
  2. 高容量密度:相对于电解电容,1210封装下实现10μF@50V,满足小型化设备的空间要求;
  3. 无极性设计:无需区分正负极,安装灵活,避免反接损坏;
  4. 环保合规:符合RoHS、REACH等环保标准,无铅无镉,适配全球市场;
  5. 品牌品质:华新科作为全球知名被动元件厂商,产品一致性好,可靠性经行业验证。

四、典型应用场景

该电容广泛应用于通用电子、工业控制、消费电子等领域:

  • 电源滤波:DC-DC转换器输出端、线性电源的纹波抑制;
  • 信号耦合:音频电路、通信模块(如Wi-Fi、蓝牙)的信号传递;
  • 去耦电容:CPU、FPGA等IC芯片的电源引脚去耦,稳定电压波动;
  • 工业控制:PLC、传感器电路的滤波与抗干扰;
  • 消费电子:机顶盒、路由器、智能家居设备的电源管理单元。

五、选型与使用注意事项

  1. 电压降额:实际工作电压≤40V(50V×80%),避免过压导致容量衰减或击穿;
  2. 温度适配:确认工作环境温度在-55℃~+125℃内,超出则容量变化超差;
  3. 安装工艺:回流焊温度需符合华新科工艺规范(如峰值温度245℃±5℃,时间≤10s),避免热应力损坏;
  4. 精度匹配:若需±5%精度,需选择“J”精度等级的同系列型号,此型号仅满足±10%需求。

该产品凭借稳定的温度特性、适中的容量与电压,成为通用电路中替代电解电容(体积大、寿命短)的理想选择,适配多场景的小型化、高可靠性设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.