WMSIC Electronic Components

Walsin 0805B106K100CT

Model0805B106K100CT
Package0805
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0805B106K100CT
Type
WALSIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0805B106K100CT
Electronic Component
1
Electronic Component
10uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0265390458
Electronic Component
X7R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0805B106K100CT陶瓷电容产品概述

一、核心参数与型号全解析

华新科0805B106K100CT是一款多层陶瓷片式电容(MLCC),型号各部分对应明确:

  • 0805:封装尺寸(英制0.08英寸×0.05英寸,公制2.0mm×1.2mm);
  • B:华新科通用MLCC系列标识;
  • 106:标称容值(10×10⁶ pF = 10μF);
  • K:容值精度(EIA标准,对应**±10%**);
  • 100:额定电压(10V DC,直流工作电压上限);
  • CT:产品子系列后缀(适配通用电路设计)。

关键参数汇总表:

参数项 具体规格 备注 封装类型 0805(SMD) 表面贴装,无引线设计 标称容值 10μF 106代码(pF单位) 容值精度 ±10%(K级) 通用电路适用精度 额定电压 10V DC 低电压电路安全范围 温度系数 X7R 工业级温度稳定性 工作温度范围 -55℃ ~ +125℃ 符合X7R介质特性 焊盘设计 Pad SMD 适配回流焊/波峰焊工艺

二、封装与物理特性

0805封装是电子设备小型化的经典选择,该电容物理特性如下:

  • 尺寸:长2.0±0.2mm,宽1.2±0.2mm,典型厚度0.8±0.1mm;
  • 重量:约0.01g,轻量化设计适合便携式设备;
  • 结构:多层陶瓷叠层+表面贴装焊盘,无引脚断裂风险,抗振动性能优异(适配车载、工业振动环境);
  • 焊盘兼容性:符合IPC标准,可直接焊接于多层PCB或高密度板,无需额外引脚处理。

三、电气性能与可靠性

3.1 核心电气性能

  • 低损耗:1kHz下损耗角正切(DF)典型值0.15%,减少信号衰减与发热,适合音频耦合、电源滤波;
  • 低漏电流:额定电压下直流漏电流(DCL)≤10μA,延长电池供电设备续航;
  • 容值稳定性:X7R介质在工作温度范围内容值变化≤±15%,比Y5V(±20%)更稳定,适配温度波动场景。

3.2 可靠性认证

  • 环保合规:符合RoHS 2.0、REACH法规,无铅无卤,适配全球市场;
  • 焊接可靠性:260℃回流焊3次(每次10秒)后,容值变化≤±5%,焊盘无脱落;
  • 环境耐久性:85℃/85%RH湿度测试1000小时,容值变化≤±10%,漏电流无明显上升;
  • 振动测试:10~2000Hz振动(加速度2g)后无开路/短路,适合便携式设备日常振动。

四、典型应用场景

该电容因小型化、低电压、稳定特性,广泛用于以下领域:

  1. 消费电子:

    • 智能手机/平板:CPU、WiFi模块电源去耦(滤除高频噪声);
    • 蓝牙耳机/智能手表:音频信号耦合(连接麦克风、扬声器);
    • 便携式游戏机:电池管理电路滤波(稳定电池输出)。
  2. 工业控制:

    • 小型PLC I/O接口滤波(减少电磁干扰);
    • 温度/压力传感器模块电源稳压(提高信号精度)。
  3. 通信设备:

    • 路由器/小型基站电源模块滤波(抑制纹波);
    • 蓝牙/WiFi模块信号耦合(保证传输质量)。

五、选型与替换参考

5.1 同参数替换

  • 三星:CL0805K106K0R0NNNC(封装0805,容值10μF,精度±10%,电压10V,X7R);
  • 村田:GRM0805C106K100KD(同参数,X7R介质);
  • 华新科同系列:0805B106K100CT(唯一后缀差异,性能一致)。

5.2 选型注意事项

  • 若需更高电压(16V):选0805B106K160CT;
  • 若需更高精度(±5%):选0805B106J100CT(J级精度);
  • 若温度范围需扩展至150℃:需换X8R/C0G介质(容值可能降低)。

总结

华新科0805B106K100CT作为通用型MLCC,凭借小型化封装、稳定温度特性、低损耗设计,成为消费电子、工业控制等低电压场景的优选组件,适配高密度PCB布局与便携式设备振动环境,满足大多数通用电路的滤波、耦合需求。

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