Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Availability on request
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603B104K250CT是由华新科技(Walsin Technology Corporation)生产的一种表面贴装多层陶瓷电容器(MLCC),主要应用于各种电子电路中。该电容器具备高稳定性和高可靠性,适用于广泛的电子设备,尤其是需要在高温和宽电压条件下工作的场景。其独特的规格和设计使其成为现代电子设计中不可或缺的基础元件。
0603B104K250CT的电容值为0.1µF,工作电压为25V。它在设计时考虑了广泛的应用需求,能在-55°C到125°C的温度范围内保持稳定的电容值。其±10%的容差范围对于一般电路应用而言非常适合,能满足大多数设计需求。
该电容器采用多层陶瓷技术制成,具有优秀的电性能和温度特性。X7R温度系数能够确保电容器在不同温度下的表现良好,适合用于温度波动较大的环境。体积小巧的0603封装(1.60mm x 0.80mm)使其非常适合现代电子设计,尤其是要求高密度组件布局的设备。
0603B104K250CT电容器广泛应用于以下领域:
0603B104K250CT电容器的设计不仅具有较小的尺寸,还具备多种优越特性:
0603B104K250CT电容器在现代电子应用中扮演着重要的角色,其优异的电气特性和机械强度使其成为设计工程师的理想选择。通过高效的表面贴装设计,这款电容器不仅适合用于高密度电路板布局,还能在紧凑的空间内提供出色的电气性能。无论是在消费电子、工业控制还是汽车电子等领域,该电容器都能为设备提供可靠的性能支持,是电子设计的基础元件之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products