WMSIC Electronic Components

Walsin 1206N221J102CT

Model1206N221J102CT
Package1206
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 73149

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
(Walsin) 1206N221J102CT
Type
WALSIN
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
1206N221J102CT
Electronic Component
1
Electronic Component
220pF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.044g
Electronic Component
1
Electronic Component
BM0265983852
Electronic Component
NP0
Voltage
1kV
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科1206N221J102CT 多层陶瓷电容器(MLCC)产品概述

一、产品核心基础参数

该型号为多层陶瓷电容器(MLCC),核心参数严格匹配华新科标准设计,具体如下:

  • 容值:220pF(编码中“N221”代表容值代码,对应22×10¹=220pF);
  • 精度:±5%(编码中“J”为精度等级代码,符合国际电工委员会IEC 60384-8标准);
  • 额定电压:1000V(1kV,编码电压段对应直流额定值,交流应用需降额);
  • 温度系数:NP0(Class 1型陶瓷介质,容值温度系数≤±30ppm/℃,宽温域稳定性优异);
  • 介质特性:NP0陶瓷属于低损耗、高Q值介质,高频下(如1MHz)损耗角正切值(tanδ)≤0.0015,信号损耗极低。

二、封装与尺寸规格

采用1206英寸表面贴装封装(对应公制3216规格),符合行业通用尺寸标准:

  • 长:3.2mm±0.2mm;
  • 宽:1.6mm±0.15mm;
  • 厚度:约1.0mm±0.1mm(具体以华新科最新 datasheet 为准)。

该封装适配各类自动化贴装设备,可兼容多数PCB板布局,尤其适合对空间紧凑性要求较高的电路设计(如小型化通信模块、便携工业设备)。

三、品牌与制造工艺特点

由华新科(Walsin) 生产,该品牌为全球MLCC领域核心供应商,具备以下工艺优势:

  • 成熟的多层陶瓷叠层技术:介质层厚度均匀性控制在±5%以内,电极烧结无分层风险;
  • 严格的质量认证:通过ISO 9001、ISO 14001及RoHS 2.0、REACH环保认证,部分系列符合IATF 16949汽车级标准;
  • 可靠性测试:产品需经过高温存储、耐电压、湿度循环等多重测试,MTBF(平均无故障时间)达10⁶小时以上,满足工业级应用需求。

四、主要应用场景

该产品因“中高压+高稳定”特性,广泛用于以下领域:

  1. 中高压电源滤波:开关电源、DC-DC转换器的高压滤波回路(如工业电源、医疗设备电源);
  2. 高频通信电路:射频(RF)模块、无线基站的谐振、耦合及滤波电路(NP0介质保证宽温域容值稳定);
  3. 工业控制与仪器:PLC(可编程逻辑控制器)、测试仪器的高精度定时、滤波电路(依赖容值一致性);
  4. 医疗设备模块:超声成像、诊断设备的中高压耦合电路(需稳定无漂移特性);
  5. 汽车电子辅助电路:车载充电系统、高压传感器模块的滤波回路(需确认具体汽车级认证适配场景)。

五、性能优势与应用注意事项

性能优势

  • 温度稳定性:-55℃至+125℃范围内,容值变化率≤±0.3%,适合高精度、宽温域场景;
  • 损耗低:高频下信号损耗极小,提升电路效率(如射频电路的信号完整性);
  • 高容量密度:1206封装实现220pF/1kV的高容量密度,节省PCB空间;
  • 可靠性强:耐电压、耐湿度性能优异,长期使用无漏液、容值漂移风险。

应用注意事项

  1. 焊接工艺:回流焊峰值温度≤260℃(持续时间≤10秒),避免温度过高导致介质开裂;
  2. 机械应力:PCB板弯曲度≤0.5%,禁止过度弯折,防止电容引脚或介质层损坏;
  3. 存储环境:存储温度0℃~40℃,湿度≤60%RH,避免受潮影响焊接及性能;
  4. 电压降额:交流应用时,峰值电压需≤70%额定电压(1kV直流→700V交流峰值),防止过压击穿。

该产品为华新科经典工业级MLCC型号,平衡了容值精度、电压耐受及空间尺寸,是中高压高精度电路的可靠选择。具体选型需结合实际应用场景(如汽车级需确认IATF认证),可参考华新科官方最新 datasheet 进一步验证。

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