WMSIC Electronic Components

Walsin 1206B473K251CT

Model1206B473K251CT
Package1206
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 73153

Availability on request

Technical data

Product details

16 specifications

Core information

Product name
(Walsin) 1206B473K251CT
Type
WALSIN
Minimum package
2000

Technical parameters

Electronic Component
(WALSIN)
Electronic Component
1206B473K251CT
Electronic Component
1
Electronic Component
47nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.044g
Electronic Component
1
Electronic Component
BM0265655347
Electronic Component
X7R
Voltage
250V
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1206B473K251CT 片式陶瓷电容产品概述

一、产品核心基本信息

1206B473K251CT是华新科(Walsin)推出的X7R介质表面贴装陶瓷电容,型号各部分含义明确,精准对应技术参数:

  • 1206:英制封装尺寸(公制3.2mm×1.6mm),属于SMT常用紧凑规格;
  • B:华新科陶瓷电容系列代号(工业级通用系列);
  • 473:容值编码(47×10³pF=47nF);
  • K:精度等级(±10%);
  • 251:额定电压(250VDC);
  • CT:封装细节与生产批次关联标识。

核心参数汇总:

参数项 具体规格 容值 47nF(473) 精度 ±10%(K级) 额定电压 250VDC 温度系数 X7R(-55℃~+125℃,容值变化±15%) 封装 1206(表面贴装) 品牌 华新科(Walsin)

二、关键性能特性解析

该产品的核心优势围绕温度稳定性、封装适配性与电压容值匹配三个维度展开:

(一)X7R介质的温度稳定性

X7R是铁电陶瓷介质的典型温度系数,其核心特点是:在-55℃至+125℃的宽温度范围内,容值变化率控制在**±15%以内**。对比Y5V(+22%~-82%)等低稳定性介质,X7R能有效避免因温度波动导致滤波、耦合效果失效,适合对容值稳定性有要求的场景。

(二)1206封装的应用适配性

1206封装是SMT市场的主流规格,具备以下实用优势:

  1. 体积紧凑:3.2mm×1.6mm的尺寸可显著节省PCB空间,适配高密度电路设计;
  2. 生产兼容:符合IPC-A-610标准的焊盘设计要求,适配自动化贴片、回流焊(260℃/10s)工艺,生产效率高;
  3. 机械可靠:封装厚度约1.2mm,抗弯强度满足工业级振动(10G~2000Hz)与冲击(100G/6ms)测试要求。

(三)电压与容值的场景匹配

250VDC额定电压+47nF容值的组合,精准覆盖中高压小容量需求:既满足电源电路的中高压纹波抑制,又避免了大容量电容的体积冗余,平衡性能与成本。

三、典型应用场景

结合性能特性,该电容适用于以下主流场景:

(一)电源电路滤波

  • 开关电源输出滤波:抑制100kHz~1MHz频段的纹波噪声,X7R的温度稳定性确保不同环境温度下滤波效果一致;
  • EMI滤波:用于电源输入端的共模/差模滤波,满足电磁兼容(EMC)标准要求(如EN55032)。

(二)信号耦合与去耦

  • 模拟电路信号耦合:如音频电路、传感器接口的信号传输,稳定容值保证信号完整性;
  • 数字电路去耦:靠近MCU、FPGA等IC电源引脚,快速提供瞬态电流,抑制电源噪声。

(三)工业控制与消费电子

  • 工业PLC、变频器:耐受-20℃~+85℃的工业环境温度,满足振动冲击要求;
  • 电视机、显示器电源模块:适配批量生产的SMT工艺,成本与性能平衡。

四、品牌与可靠性保障

华新科作为全球前五大被动元器件厂商,该产品的可靠性经过严格验证:

  1. 环保合规:符合RoHS 2.0、REACH SVHC等标准,无铅无卤;
  2. 焊接可靠:通过回流焊、波峰焊测试,无焊接缺陷;
  3. 寿命验证:在额定电压(250VDC)、+85℃环境下,MTBF(平均无故障时间)超过10⁶小时;
  4. 质量体系:通过ISO 9001、IATF 16949(汽车级)认证,可用于汽车电子辅助电路(需确认车规版本)。

五、选型与使用注意事项

  1. 电压降额:实际工作电压建议不超过额定电压的80%(即200VDC),延长寿命;
  2. 温度适配:若环境温度超过+125℃,需切换至X8R介质(-55℃~+150℃);
  3. 精度需求:若需±5%精度,选择J级精度的同封装产品(如1206B473J251CT);
  4. PCB设计:焊盘尺寸建议为3.4mm×1.8mm(IPC标准),避免焊盘过小导致焊接不良。

该产品凭借稳定的性能、紧凑的封装与可靠的品牌保障,成为中高压小容量电路的优选元件,广泛适配工业、消费电子等领域的常规应用需求。

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