Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Availability on request
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
华新科(Walsin)WR04X2002FTL是一款0402封装的通用型厚膜贴片电阻,专为小型化、高可靠性电子电路设计,具备精准阻值控制、宽温适应性及稳定性能,广泛适用于消费电子、汽车电子、工业控制等领域。
该型号属于华新科WR04系列厚膜电阻的标准款,核心定位为中小功率、通用精度的小型化电阻,满足多数电子设备对电阻的基础性能需求,典型应用场景包括:
该型号的关键参数与性能如下,符合工业级电子元器件的基本要求:
参数项 规格值 说明 电阻类型 厚膜贴片电阻 氧化铝陶瓷基底+厚膜电阻浆料 标称阻值 20kΩ(代码:2002) 激光微调保证批次一致性 精度等级 ±1% 工业通用精度,覆盖多数场景 额定功率 62.5mW(1/16W) 0402封装的典型额定功率 最大工作电压 50V 绝对最大额定值,需降额使用 温度系数(TCR) ±100ppm/℃ 每升高1℃,阻值变化±2Ω(20kΩ×100ppm) 工作温度范围 -55℃ ~ +155℃ 覆盖工业级与汽车级温度需求性能优势:厚膜工艺赋予其良好的抗冲击性、耐温稳定性,激光微调技术确保阻值精度一致,适合批量生产的一致性要求。
该型号采用0402英制贴片封装(对应公制1005封装),是当前小型化电子设备中最常用的贴片封装之一,物理尺寸符合行业标准:
封装特点:引脚间距紧凑(约0.4mm),适合高密度PCB设计,可兼容回流焊、波峰焊等标准贴片工艺(焊接温度需控制在260℃以下,持续时间不超过10秒)。
华新科WR04X2002FTL通过多项可靠性测试,适配严苛环境:
华新科(Walsin)作为全球领先的被动元件供应商,具备以下优势:
该型号凭借小型化、高可靠性及成本优势,成为众多电子设备的首选贴片电阻之一,可满足多数通用电路的性能需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products