Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HL 2300
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HL 2300
- Type
- HL
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HL
- Electronic Component
- 2300
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Electronic Component
- BM0265676888
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 358pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
富海微SOT-23封装N沟道MOS管（型号2300）产品概述
一、产品定位与核心身份
这款MOS管是富海微（HL）推出的N沟道增强型MOSFET，采用超小型SOT-23表面贴装封装，专为低电压、中小电流的便携/消费电子场景设计。核心定位是“小封装、低损耗、易驱动”，能平衡空间节省与性能需求，适合对PCB布局紧凑性要求高的产品。
二、关键电气参数与性能亮点
参数针对性强，覆盖低电压系统的核心需求：
（1）电压电流与驱动特性
- 耐压与电流：漏源击穿电压（Vdss）20V，覆盖5V/12V以下低电压场景；连续漏极电流（Id）5.2A，同封装中电流能力突出；
- 低阈值驱动：阈值电压（Vgs(th)）1V@250uA，无需额外电平转换，可直接被3.3V单片机驱动，简化电路设计。
（2）导通与功耗控制
- 低导通电阻：RDS(on)=27mΩ@4.5V，同电压同封装竞品多为30-40mΩ，损耗降低约20%，减少发热；
- 功率能力：耗散功率（Pd）1W，配合低RDS(on)，稳定承载中小电流负载。
（3）开关与可靠性
- 快速开关：栅极总电荷（Qg）5.6nC@10V，开关速度快，适合高频DC-DC转换；
- 宽温适应：工作温度-55℃~+150℃（结温），覆盖户外、工业低温等极端场景。
三、封装适配与典型应用
SOT-23封装是核心优势：
- 空间节省：尺寸仅2.9×1.6×1.1mm，适配耳机、智能手环等超便携产品；
- 焊接友好：标准引脚布局，兼容常规回流焊，生产效率高。
落地场景：
- 充电模块负载开关：手机快充头中控制充电回路通断，降低空载损耗；
- 小型DC-DC转换：5V转3.3V/1.8V，输出1-2A满足MCU供电；
- 便携电源管理：蓝牙音箱、TWS充电盒的电源切换，延长续航；
- IoT节点开关：传感器节点电源切换，低阈值易驱动，待机功耗低。
四、选型对比与实用价值
和同类竞品比，优势明显：
- 低损耗：27mΩ导通电阻比竞品低20%，相同电流下发热更少；
- 高电流：5.2A连续电流超出同封装多数产品（3-4A）；
- 宽温可靠：-55℃+150℃比消费级产品（-40+85℃）适应更广；
- 快开关：5.6nC栅极电荷适合高频应用（1MHz以上DC-DC）。
五、注意事项与降额建议
- 结温降额：150℃为结温，环境85℃时连续电流建议≤3.5A；
- 驱动电压：建议≥4.5V（RDS(on)最优），避免电压过低导致损耗增大；
- 散热设计：负载接近5.2A时，PCB需增加散热铜箔，避免过热。
这款MOS管是低电压中小电流场景的“性价比之选”，小封装、低损耗、易驱动的特点，完美适配便携设备、消费电子、IoT等领域的紧凑设计需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
