WMSIC Electronic Components

HL 40N05

Model40N05
PackageSOT-23-3L
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 40N05
Type
HL
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
40N05
Electronic Component
1
Package
SOT-23-3L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0265709399
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
73W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HL 40N05 N沟道功率MOSFET产品概述

一、产品核心定位与基本属性

HL 40N05是富海微(HL)推出的一款中低压N沟道增强型功率MOSFET,主打中小功率开关、负载驱动及电源管理场景。该器件采用SOT-23-3L小封装,兼顾紧凑性与性能,可满足便携设备、车载辅助系统、工业控制等领域的轻量化集成需求。

核心基础属性明确:

  • 类型:N沟道增强型
  • 电压等级:漏源最大耐压40V
  • 电流能力:连续漏极电流7A
  • 温度范围:-55℃~+150℃(工业级宽温)

二、关键电气参数深度解析

1. 电压与电流的安全余量

  • 漏源击穿电压(Vdss):40V,远高于12V/24V系统的工作电压,预留充足安全余量,避免过压损坏(如车载电源波动、电源尖峰等场景);
  • 连续漏极电流(Id):7A,满足小型电机、LED阵列、继电器等中小功率负载的持续驱动需求,瞬间峰值电流能力可覆盖短暂过载(如电机启动瞬间)。

2. 导通损耗与功耗控制

  • 导通电阻(RDS(on)):仅19mΩ(典型值),处于同封装同参数级别的领先水平。以7A负载为例,导通损耗仅约0.93W(P=I²×R),大幅降低发热,减少散热设计压力;
  • 最大耗散功率(Pd):73W,结合SOT-23-3L封装的热性能,可支撑连续工作时的功率输出,适配常规板级散热方案(无需额外散热片)。

3. 开关特性与EMI平衡

  • 栅极电荷量(Qg):12nC(Vgs=10V时),栅极电荷低意味着开关过程中能量损耗小,可实现较快的开关速度(适合100kHz以下高频应用);
  • 电容参数:输入电容(Ciss=633pF)、反向传输电容(Crss=58pF)、输出电容(Coss=67pF)优化平衡,既保障开关速度,又控制电磁干扰(EMI),适合对噪声敏感的场景(如音频设备、传感器节点)。

4. 控制适配与温度稳定性

  • 阈值电压(Vgs(th)):2.5V,适配3.3V/5V等常见MCU控制电平,无需额外电平转换电路即可驱动;
  • 宽温特性:-55℃~+150℃覆盖工业级与车载级温度要求,极端环境下性能稳定(如北方冬季户外、车载高温环境)。

三、封装与热特性说明

HL 40N05采用SOT-23-3L表面贴装封装,尺寸约1.6mm×2.9mm×1.1mm(典型值),属于小型封装,可有效节省PCB板空间,适合高密度布局(如便携设备主板、小型控制模块)。

封装热阻(RθJA)约170℃/W(典型值,需结合实际PCB设计),配合器件低导通损耗的特性,可满足多数中小功率应用的散热需求:例如7A负载下,器件表面温度约150℃(环境温度25℃时),符合工作温度上限要求。

四、典型应用场景

1. 12V/24V电源系统

  • 车载点烟器转换电源、小型开关电源适配器、移动电源升压/降压模块;
  • 优势:40V耐压提供安全余量,7A电流覆盖常见负载,低损耗提升转换效率。

2. 中小功率负载驱动

  • LED照明(汽车氛围灯、小型台灯)、小型直流电机(玩具电机、智能门锁)、继电器线圈驱动;
  • 优势:低RDS(on)减少驱动发热,宽温特性适配不同使用环境。

3. 便携电子设备

  • 蓝牙音箱、智能手环的功率开关、移动电源输出控制;
  • 优势:SOT-23-3L小封装符合轻量化需求,稳定特性保障续航与可靠性。

4. 工业控制节点

  • 小型传感器节点开关控制、PLC辅助输出模块;
  • 优势:宽温范围适应工业现场温度波动,7A电流满足小型执行器驱动。

五、选型优势总结

HL 40N05在中小功率MOSFET领域具备核心竞争力:

  1. 高效节能:低导通电阻+低栅极电荷,同时降低导通损耗与开关损耗;
  2. 宽温可靠:工业级温度范围,适配车载、工业等极端环境;
  3. 适配性强:阈值电压适配常见控制电平,电压电流覆盖多数中小功率应用;
  4. 紧凑集成:小封装节省板级空间,适合高密度设计;
  5. 成本效益:国产化器件,性能相当前提下成本更优。

该器件可作为12V/24V系统中小功率开关的优选方案,兼顾性能、尺寸与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.