WMSIC Electronic Components

HL 6G03L

Model6G03L
PackageSOT-23-6L
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 6G03L
Type
HL
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
6G03L
Electronic Component
1
Package
SOT-23-6L
Electronic Component
1 N +1 P
Type
N +P
Electronic Component
MOSFET
Electronic Component
0.046g
Electronic Component
1
Electronic Component
BM0265847003
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.5W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HL 6G03L 复合场效应管产品概述

富海微(HL)推出的6G03L是一款N沟道+P沟道复合MOSFET,采用SOT-23-6L小尺寸表面贴装封装,针对低电压(≤30V)、中小功率(≤2.5W)、高密度集成场景优化,兼具低导通损耗、快开关速度与宽温可靠性,适用于便携式电子、Type-C接口、小型负载驱动等多类应用。

一、产品核心定位与应用场景

6G03L的设计核心是**“小封装下的高集成与高效能”**,精准匹配消费电子、工业控制中对空间敏感、低功耗的需求:

  • 便携式设备:如TWS耳机充电盒、智能手表、便携充电宝的电源充放电控制;
  • Type-C接口电路:VBUS电源路径切换、PD协议下的电压电流动态控制;
  • 小型负载驱动:智能手环振动马达、LED背光模组、小型直流风扇的通断管理;
  • 低电压开关:5V/12V电源系统的通断切换、电池保护电路的辅助控制。

二、关键电参数特性解析

该器件的电参数平衡了导通损耗、开关速度与可靠性,具体特性如下:

1. 耐压与电流能力适配低电压系统

漏源击穿电压(Vdss)30V,覆盖常见低电压电源(3.7V锂电池、5V/9V/12V适配器);连续漏极电流(Id)9A,峰值电流能力可满足瞬时大电流需求(如TWS充电盒快充瞬间),无需额外并联器件,简化电路设计。

2. 低导通电阻降低损耗

导通电阻(RDS(on))仅25mΩ@10V栅源电压,在SOT-23-6L封装中处于同类产品前列。以5A连续电流为例,导通损耗为I²×R=5²×0.025=0.625W,远低于最大耗散功率(Pd=2.5W),有效提升电池供电设备的续航能力。

3. 快开关速度适配高频应用

栅极电荷量(Qg)[email protected],输入电容(Ciss)370pF、反向传输电容(Crss)40pF,开关速度快且驱动损耗低。例如,在1MHz开关频率下,驱动损耗约为36mW(计算:Qg×Vgs×f=7.2e-9C×5V×1e6Hz),适合开关电源、脉冲驱动等高频场景。

4. 宽温与阈值电压适配多驱动逻辑

  • 阈值电压(Vgs(th))2.5V@250μA,兼容3.3V/5V逻辑电平,无需电平转换电路,降低系统复杂度;
  • 工作温度范围-55℃+150℃,满足工业级(-40℃+85℃)与消费电子极端环境(如户外便携设备高温)需求,可靠性更高。

三、封装与可靠性设计

6G03L采用SOT-23-6L封装,尺寸仅约2.9mm×1.6mm×1.1mm,是同类复合MOSFET中体积最小的封装之一,可有效节省PCB空间,适配高密度集成设计(如TWS充电盒内部狭窄布局)。

此外,封装设计优化了热传导路径,结合2.5W的最大耗散功率,可稳定支撑小功率持续工作;宽温范围与高ESD防护(隐含工业级设计特性)进一步提升了器件在恶劣环境下的可靠性。

四、典型应用案例

1. TWS耳机充电盒电源开关

6G03L的N/P复合管可实现充电盒电池与Type-C接口的双向导通:充电时P沟道导通输入电流,放电时N沟道导通输出电流,小封装适配充电盒内部狭窄空间,低导通损耗延长电池续航。

2. Type-C VBUS电源切换

在Type-C PD协议中,6G03L可作为VBUS路径的互补开关:当设备作为电源输出时N沟道导通,作为受电时P沟道导通,快开关速度适配PD协议的电压电流快速切换,避免浪涌干扰。

3. 智能手表LED背光驱动

6G03L的9A电流能力可驱动多颗LED背光,低导通电阻减少压降(5V电源下5A电流压降仅0.125V),提升背光亮度一致性,宽温范围满足手表在户外高温下的稳定工作。

五、产品总结

HL 6G03L是一款高集成度、小尺寸、高效能的复合MOSFET,核心优势在于:

  • 复合管设计(N+P)简化双向控制电路,减少元件数量;
  • 低RDS(on)与快开关速度平衡导通/驱动损耗,提升系统效率;
  • SOT-23-6L封装适配高密度集成,节省PCB空间;
  • 宽温范围与宽逻辑驱动兼容多场景,可靠性更高。

该器件可有效降低系统成本与空间占用,是便携式电子、Type-C接口等低电压小功率场景的理想选择。

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