WMSIC Electronic Components

HL 20P03

Model20P03
PackageTO-252
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 20P03
Type
HL
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
20P03
Electronic Component
1
Package
TO-252
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.482g
Electronic Component
1
Electronic Component
BM0265676885
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
19W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

20P03 P沟道MOSFET产品概述

20P03是HL富海微推出的P沟道增强型MOSFET,采用TO-252(DPAK)表面贴装封装,定位于中低压大电流功率转换场景,具备低损耗、高开关速度、宽温可靠等核心特点,可覆盖工业控制、汽车电子、便携式设备等多领域应用需求。

一、产品基本定位

20P03针对12V/24V低压直流系统设计,旨在解决传统继电器或双极型晶体管(BJT)在大电流下损耗高、开关速度慢的问题。其紧凑的TO-252封装兼顾散热效率与自动化生产便利性,是低压功率转换场景中替代传统开关器件的优选方案。

二、关键电气参数解析

20P03的电气参数精准匹配低压大电流应用,核心参数及实际意义如下:

1. 电压与电流能力

  • 漏源击穿电压(Vdss):30V,覆盖12V/24V系统的工作电压范围,留有足够安全裕量,避免过压损坏;
  • 连续漏极电流(Id):20A,可稳定承载持续大电流负载,无需额外并联器件,简化电路设计;
  • 最大耗散功率(Pd):19W,反映器件散热能力,结合TO-252封装的散热焊盘设计,满足多数低压功率场景的发热需求。

2. 导通与开关特性

  • 导通电阻(Rds(on)):50mΩ(Vgs=10V时),处于同规格器件的优势水平,导通损耗(P=I²·Rds(on))显著降低(如20A负载下损耗仅20W),提升系统效率;
  • 栅极总电荷(Qg):6.8nC(Vgs=10V时),栅极电荷是影响开关速度的核心参数,低Qg意味着开关损耗小,适合几十kHz的高频功率转换场景;
  • 电容参数:输入电容Ciss=530pF、反向传输电容Crss=56pF、输出电容Coss=70pF,电容值合理,可减少开关过程中的电压过冲,提升电路稳定性。

3. 阈值与温度特性

  • 阈值电压(Vgs(th)):2.5V(Id=250uA时),属于常规阈值范围,兼容常见MCU或驱动电路的输出电压,无需额外升压驱动;
  • 工作温度范围:-55℃+175℃,覆盖工业级(-40℃+85℃)及汽车级(-55℃~+150℃)温度要求,可适应极端气候环境(如沙漠高温、极地低温)。

三、封装与可靠性设计

20P03采用TO-252封装(表面贴装型),具备以下优势:

  • 体积紧凑(尺寸约6.5mm×5.0mm×2.0mm),适合高密度电路板设计;
  • 散热焊盘与引脚设计合理,可通过PCB铜箔快速导出热量,提升散热效率;
  • 引脚间距适中,焊接工艺成熟,适合自动化贴装生产。

可靠性方面,20P03通过宽温老化测试,参数一致性好,高低温循环下性能稳定,可避免导通电阻漂移或阈值电压偏移,适合长期可靠运行的场景(如汽车电子、工业控制器)。

四、典型应用场景

结合20P03的参数特点,其典型应用包括:

  1. 低压直流电源:12V/24V开关电源的同步整流管(替代肖特基二极管,提升效率)、电源系统负载开关;
  2. 汽车电子:12V车载系统的负载控制(车灯调光、中控模块、座椅加热)、电池管理系统(BMS)充放电控制;
  3. 便携式设备:笔记本电脑、移动电源的功率转换(提升续航,减少发热)、无人机/平衡车的低压电机驱动;
  4. 工业控制:低压电机软启动/停止控制(替代继电器,无触点磨损)。

五、核心性能优势总结

20P03的核心优势可归纳为:

  1. 低损耗高效:50mΩ低导通电阻+6.8nC低栅极电荷,兼顾导通与开关损耗,系统效率提升5%~10%;
  2. 宽温可靠:-55℃~+175℃工作范围,满足工业/汽车级环境需求;
  3. 大电流承载:20A连续漏极电流,无需并联即可满足大负载需求;
  4. 设计灵活:兼容常规驱动电路,TO-252封装适配多种PCB布局;
  5. 品牌保障:HL富海微器件经过严格测试,参数一致性好,长期可靠性高。

综上,20P03是一款性能均衡的P沟道MOSFET,为低压大电流功率转换领域提供高效、可靠的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.