Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon IRF9530NPBF
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Infineon IRF9530NPBF
- Type
- INFINEON
- Unit
- Electronic Component
- Minimum package
- 1000 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- IRF9530NPBF
- Electronic Component
- 1
- Package
- TO-220AB
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 2.967g
- Electronic Component
- 1
- Electronic Component
- BM0000281006
- Operating Temperature
- 55℃~+175℃
- Power Dissipation(Pd)
- 79W
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRF9530NPBF 产品概述
一、产品简介
IRF9530NPBF 是一款高性能的 P 通道 MOSFET，专为电源管理和高效率应用而设计，具备优良的导电性能和热管理能力。此器件具有最大漏源电压（Vdss）为 100V 和连续漏极电流 (Id) 为 14A 的规格，适合于多种功率电子电路中，如开关电源、电机驱动和充电器应用。基于 Infineon（英飞凌）公司的先进技术，该 MOSFET 提供可靠的性能，能够有效地满足现代电子设备日益增长的功率和效率要求。
二、基本参数
- FET 类型：P 通道 MOSFET
- 最大漏源电压（Vdss）：100V
- 25°C 时连续漏极电流 (Id)：14A（Tc）
- 驱动电压：最大 Rds On，最小 Rds On 为 10V
- 最大导通电阻 (Rds On)：在 8.4A 和 10V下最大为 200 毫欧
- 阈值电压 (Vgs(th))：在 250µA 下最大值为 4V
- 栅极电荷 (Qg)：在 10V 下最大为 58nC
- 栅源电压 (Vgs)：最大值为 ±20V
- 输入电容 (Ciss)：在 25V 下最大为 760pF
- 最大功率耗散：79W（Tc）
- 工作温度范围：-55°C ~ 175°C（TJ）
- 安装类型：通孔（Through-hole）
- 封装类型：TO-220AB
三、应用领域
IRF9530NPBF MOSFET 广泛应用于各种电子产品的电源管理，包括但不限于：
- 开关电源 (SMPS)：用于高效电能转换，提升能源使用效率。
- 电机控制：在直流或步进电机驱动电路中，作为开关元件以控制电机的启停和速度调节。
- 充电器：在各种充电设备中，IRF9530NPBF 可用于控制充电过程中的电流和电压，以确保充电安全和高效。
- 线性和开关电源：在电流和电压控制中提供可靠的开关性能，帮助降低整体功耗。
四、技术优势
- 高效率：IRF9530NPBF 具有较低的导通电阻和高温稳定性，减少了电能在器件内部的损耗，提高了系统的整体效率。
- 宽工作温度范围：这款 MOSFET 可在宽达 175°C 的高温环境下可靠工作，适用于高温和严酷环境条件下的应用。
- 优秀的热管理：TO-220AB 封装设计使得 IRF9530NPBF 具备良好的散热性能，有助于增强器件的功率承载能力和可靠性。
五、结论
作为一款高性能 P 通道 MOSFET，IRF9530NPBF 结合了卓越的电气性能和宽广的应用灵活性，为电源管理和高效率设计提供了理想解决方案。其显著的导电特性和优越的热管理能力，确保在各种电气环境中工作的稳定性和可靠性。因此，IRF9530NPBF 是工程师在设计现代电子产品时，值得信赖的选择之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
