WMSIC Electronic Components

Infineon IRF640NSTRLPBF

ModelIRF640NSTRLPBF
PackageD2PAK
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRF640NSTRLPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRF640NSTRLPBF
Electronic Component
1
Package
D2PAK
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
2.343g
Electronic Component
1
Electronic Component
BM0223592393
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
150W
Electronic Component
Electronic Component
Electronic Component
800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRF640NSTRLPBF 产品概述

1. 概述

IRF640NSTRLPBF 是一款高性能的 N 通道 MOSFET,具有强大的漏源电压(Vdss)和连续电流能力。其设计旨在满足苛刻的电源管理、开关应用以及驱动负载的需求。作为 Infineon(英飞凌)公司的产品,该 MOSFET 体现了出色的电气特性和可靠性,广泛应用于工业、汽车及消费电子等领域。

2. 主要规格

  • FET 类型: N 通道
  • 技术: MOSFET(金属氧化物)
  • 漏源电压(Vdss): 200V
  • 最大连续漏极电流 (Id): 18A(在 25°C 时 Tc)
  • 导通电阻(Rds On): 在 10V 驱动电压下,11A 时最大导通电阻为 150 毫欧
  • 栅极阈值电压 (Vgs(th)): 最大 4V(在 250µA漏电流时)
  • 栅极电荷 (Qg): 最大 67nC(在 10V 驱动电压下)
  • 输入电容 (Ciss): 最大 1160pF(在 25V 时)
  • 功率耗散: 最大 150W(在 25°C 时 Tc)
  • 工作温度范围: -55°C ~ 175°C(TJ)
  • 安装类型: 表面贴装型
  • 封装: D2PAK(TO-263AB)

3. 结构与设计

IRF640NSTRLPBF 采用 D2PAK(2 引线 + 接片)封装,设计上方便于快速安装并保持良好的散热性能。封装大小恰到好处,适合在有限的空间中使用,同时能够支持高功率的应用环境。MOSFET 的设计有效降低了导通损耗,保障了更高的使用效率,确保系统的热管理在安全范围内。

4. 应用场景

IRF640NSTRLPBF 被广泛应用于多个领域,包括但不限于:

  • 电力转换: 用于 DC-DC 转换器、逆变器等电源管理设备,提供高效的电力转换。
  • 电机驱动: 在电机控制和驱动应用中表现出色,以高效率和较低的热文温度影响电机运行。
  • 开关电源供应: 由于其高电压和高电流的能力,适合于开关电源(SMPS)的应用,确保稳定性与可靠性。
  • 工业自动化: 用于各种自动化设备中,增强其控制与驱动功能。

5. 优势特点

  • 高电压和电流能力: 200V 的漏源电压和 18A 的连续电流支持各种高功率应用。
  • 低导通电阻: 150 毫欧的低导通电阻特点,帮助减少功耗,提高能效。
  • 广泛的工作温度范围: 从 -55°C 到 175°C 的工作温度范围,使其适应极端环境下的操作需求。
  • 良好的热管理能力: 150W 的功率耗散能力,保证器件在高负载下的可靠性。

6. 结论

IRF640NSTRLPBF 是一款功能强大的 N 通道 MOSFET,适合各种高性能应用,结合了高电压、连续电流及低导通电阻等优异特性。其可靠的工作温度范围和功率耗散能力,使其成为工业及汽车领域中不可或缺的组件。选择 IRF640NSTRLPBF,您将获得出色的电气性能与产品可靠性,为您的设计提供强有力的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.