Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRFR3410TRPBF 是一款高性能的 N 通道 MOSFET (金属氧化物半导体场效应管),由知名半导体供应商 Infineon(英飞凌)出品。其设计目标是提供卓越的功率控制和高效的开关性能,适用于各种功率管理和信号调节应用。该器件采用 TO-252-3(D-Pak)封装,专为表面贴装电路设计,便于在高密度电路板上高效组装。
漏源电压 (Vdss): IRFR3410TRPBF 的漏极源极电压可达 100V。这使其可以在高电压环境下正常工作,适用于中高压应用场合。
连续漏极电流 (Id): 在 25°C 的条件下,该 MOSFET 支持最大连续漏极电流为 31A。这一特性确保了在较高负载下稳定的工作性能。
最大导通电阻 (Rds(on)): 在 10V 的栅极驱动电压下,当漏极电流为 18A 时,其最大导通电阻为 39 毫欧。这一低导通电阻意味着在工作时能量损耗较小,有助于提高整体电源效率。
栅极阈值电压 (Vgs(th)): 最大值可达到 4V,且在 250µA 的漏极电流下有效。这一特性可以确保 MOSFET 在低电压驱动情况下也能快速导通。
栅极电荷 (Qg): 其最大栅极电荷为 56nC(在 10V 时测量),这一特性对于高频开关应用非常重要,能够实现快速响应。
输入电容 (Ciss): 在 25V 时,其输入电容最大值为 1690pF,较高的输入电容通常有助于实现公共地连接和驱动性能,适合于变化频繁的电路。
功率耗散: IRFR3410TRPBF 最大功率耗散可达到 110W(在 Tc 条件下)以及 3W(在 Ta 环境温度下)。此性能附加保障了器件在高功率应用下的可靠性。
工作温度范围: 其工作温度范围为 -55°C 至 175°C,使其在极端环境条件下依旧能够稳定运行,特别适合航空航天、汽车电子等应用。
封装与安装: 采用表面贴装型 TO-252-3 封装,具备良好的散热性能与空间利用率,适合在现代电子产品中实现高密度布局。
IRFR3410TRPBF 可广泛应用于多个领域,包括但不限于:
总体而言,IRFR3410TRPBF 作为一款高压、大电流、低导通电阻的 N-channel MOSFET,凭借其优越的电气特性以及广泛的应用潜力,将为设计工程师在功率管理和高效能应用中提供强有力的解决方案。其耐高温、稳健的设计使其在各种极端工况下均能保持良好性能,为现代电子产品的可靠性与性能做出了重要贡献。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products