WMSIC Electronic Components

Infineon BSP89H6327XTSA1

ModelBSP89H6327XTSA1
PackageSOT-223-4
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BSP89H6327XTSA1
Type
INFINEON
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSP89H6327XTSA1
Electronic Component
1
Package
SOT-223-4
Electronic Component
MOSFET
Electronic Component
MOSFET
Electronic Component
0g
Electronic Component
1
FET Type
N
Electronic Component
BM0000225944
Type
Surface Mount
Operating Temperature
55°C ~ 150°C(TJ)
Package / Housing
TO-261-4,TO-261AA
Vgs
±20V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BSP89H6327XTSA1

一、简介

BSP89H6327XTSA1是一款高性能的N通道金属氧化物场效应晶体管(MOSFET),由知名半导体制造商英飞凌(Infineon)出品。该器件以其卓越的电性能和广泛的适用性,成为各类电子电路中的重要组成部分,尤其适合高压开关和功率控制的应用场景。

二、主要参数

BSP89H6327XTSA1的基本参数如下:

  • FET类型:N通道
  • 技术:MOSFET(基于金属氧化物技术)
  • 漏源电压(Vdss):最大240V
  • 连续漏极电流(Id):350mA(在25°C环境温度下)
  • 导通电压(Vgs):支持4.5V至10V的驱动电压,确保优良的开关性能
  • 最大导通电阻:在10V和350mA时,最大导通电阻为6欧姆
  • 阈值电压(Vgs(th)):最大1.8V(在108μA测量的情况下)
  • 栅极电荷(Qg):最大6.4nC(在10V下测得)
  • 栅源电压(Vgs):最大±20V
  • 输入电容(Ciss):在25V下最大为140pF
  • 功率耗散:最大为1.8W
  • 工作温度范围:-55°C至150°C
  • 外壳封装类型:PG-SOT223-4及其他封装如TO-261-4和TO-261AA

三、应用领域

BSP89H6327XTSA1在多个领域内展现出极强的适应性。其主要应用包括但不限于:

  1. 电源管理:在开关电源、线性稳压器及直流-直流转换器中,可以作为高侧或低侧开关,极大地提高能效。
  2. 功率放大:在音频和射频放大电路中起到信号放大和控制的作用。
  3. 电动机控制:应用在电动机驱动电路中,可用于调速、启停及反向等控制。
  4. LED驱动:在LED照明解决方案中,可以用来稳定输出电流,提供更好的色彩还原度。
  5. 汽车电子:在汽车的电源管理、负载控制及智能能源系统中,也有着广泛的应用。

四、技术优势

  1. 高压性能:BSP89H6327XTSA1具备240V的高漏源电压能力,适合高压应用,更加安全稳定。
  2. 低导通电阻:6欧姆的导通电阻确保了低能量损耗,适应要求高效率的电源线路。
  3. 宽工作温度范围:设备能够在-55°C至150°C范围内稳定工作,适合各种环境条件。
  4. 小型封装:采用SOT-223封装,减小占板面积,便于表面贴装和自动化生产,提高生产效率。

五、结论

综上所述,BSP89H6327XTSA1是一款优秀的N通道MOSFET,其高效能和出色的电性能使其在现代电子设备中得到了广泛的应用。英飞凌作为行业领军企业,其产品在设计与制造上均经过严格把控,确保了BSP89H6327XTSA1具有可靠的性能和长久的使用寿命。对于电源管理、功率放大、电动机控制等领域的设计师而言,BSP89H6327XTSA1无疑是一个值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.