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Infineon BGC100GN6E6327XTSA1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- Infineon BGC100GN6E6327XTSA1
- Type
- INFINEON
- Minimum package
- 15000
Technical parameters
- Electronic Component
- INFINEON
- Electronic Component
- BGC100GN6E6327XTSA1
- Electronic Component
- 1
- Package
- TSNP-6-2
- Electronic Component
- 0g
- Frequency
- 600MHz ~ 2.7GHz
- Electronic Component
- 1
- Electronic Component
- BM0265605133
- Type
- Surface Mount
- RFType
- CDMA, GSM, HSPA+, LTE, TD-SCDMA, W-CDMA
- Package / Housing
- 6-XFDFN
- Electronic Component
- 15000
- Devices Package
- TSNP-6-2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BGC100GN6E6327XTSA1 产品概述
一、产品简介
BGC100GN6E6327XTSA1 是英飞凌（Infineon）面向移动终端与基站射频前端的双向耦合器（bi-directional coupler）IC。工作频率覆盖 600 MHz 至 2.7 GHz，适配手机、CDMA、GSM、HSPA+、LTE、TD-SCDMA、W‑CDMA 等多种蜂窝通信制式。器件为表面贴装型，封装为 TSNP-6-2（供应商封装标识 TSNP-6-2 / 6-XFDFN），便于空间受限的RF模块集成。
二、主要特性
- 宽带工作：600 MHz ~ 2.7 GHz，覆盖 2G/3G/4G 主流频段。
- 双向监测：支持正向/反向功率采样，便于功率控制与驻波比（VSWR）监测。
- 集成化设计：小尺寸封装，便于与功率放大器（PA）、开关及检测电路共同布置。
- 射频兼容性：适用于手机及无线通信终端的多模多频应用。
- 表面贴装（SMD）：符合自动化贴片与回流焊装配工艺。
三、典型应用
- 手机与智能终端的发射功率检测与回波监测。
- 射频功放模块内的前端功率与方向性监测。
- 基站小型化收发模块、射频调试与校准通道。
- 与功率检测二极管或RF ADC 配合，用于闭环功率控制与射频保护。
四、封装与布局建议
TSNP-6-2 小型封装利于紧凑布局，但对射频走线及接地要求较高。建议关键布局要点：
- 射频输入/输出使用 50 Ω 微带线或带状线，最短路径连接至功放与天线开关。
- 地平面完整且贯通，尽量在器件底部提供连续接地以降低寄生。
- 耦合端口旁保留足够焊盘并配置阻抗匹配或终端电阻，防止反射影响测量精度。
- 遵循厂家回流焊温度曲线与湿敏等级要求，避免超时回流或过热。
五、热与可靠性、保管
- 器件为射频敏感元件，须按 ESD 防护规范操作。
- 存储符合干燥箱条件，按制造商指定的 MSL 等级处理。
- 关注最大功率与环境温度限制，必要时在系统设计中提供热路径或散热结构。
六、选型与资料建议
本概述强调器件应用与布局要点，但详细的电气参数（耦合系数、方向性、插损、隔离、最大输入功率等）、引脚定义与绝对额定值请参阅英飞凌官方数据手册。选型时可与同类双向耦合器比较方向性和带内响应，以满足系统精度与线性要求。若需替代或更多支持，可联系英飞凌或授权分销商获取样片与技术资料。
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