WMSIC Electronic Components

Infineon BSD235CH6327XTSA1

Infineon BSD235CH6327XTSA1
1 / 2

Product image

ModelBSD235CH6327XTSA1
PackageSOT-363
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
Infineon BSD235CH6327XTSA1
Type
INFINEON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSD235CH6327XTSA1
Electronic Component
1
Package
SOT-363
Electronic Component
MOSFET
Electronic Component
0g
Electronic Component
1
FET
Logic Level Gate
FET Type
N and P
Electronic Component
BM0058413344
Type
Surface Mount
Operating Temperature
55°C ~ 150°C（TJ）
Power
500mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSD235CH6327XTSA1 产品概述

引言

在现代电子设备中，功率控制和开关性能已成为设计的重要组成部分。MOSFET（金属氧化物半导体场效应晶体管）因其优越的性能和广泛的应用场景，已成为众多电子元器件中不可或缺的一部分。BSD235CH6327XTSA1是由英飞凌（Infineon）推出的一款高性能MOSFET阵列，属于N沟道和P沟道类型，在低功耗和高效率的应用中表现卓越。

基本参数

BSD235CH6327XTSA1是一款表面贴装型MOSFET，封装采用SOT-363，适合于高密度的PCB设计。其具有多项显著的电气性能，适用于逻辑电平控制，特别是在数字电路和功率转换中。

  1. 导通电阻（Rds(on）：当在4.5V的栅源电压下，导通电阻最大值为350毫欧，这使得其在电流950mA下表现出优良的导通性能。

  2. 漏极电流（Id）：该器件支持最高950mA（N沟道）和530mA（P沟道）的连续漏极电流，大大提高了其在实际应用中的灵活性。

  3. 栅极阈值电压（Vgs(th)）：在1.6µA的漏电流时，栅极阈值电压最大值为1.2V，满足逻辑电平驱动的要求，使得其在低电平逻辑电路中的适用性更广。

  4. 输入电容（Ciss）：在10V下，输入电容最大值为47pF，这一低电容特性使其在快速开关应用中表现优秀。

  5. 栅极电荷（Qg）：在4.5V下，最大栅极电荷为0.34nC，表明其在驱动上也具有较低的功耗，从而提高电路的整体效率。

  6. 工作温度范围：BSD235CH6327XTSA1的工作温度范围为-55°C到150°C（TJ），这使得该元件能够在极端条件下稳定运行，适用于汽车、航空航天等要求严格的环境。

  7. 功率处理能力：该MOSFET具有500mW的最大功率处理能力，能够在多种应用场景中提供有效的功率管理。

应用场景

BSD235CH6327XTSA1特别适用于以下场景：

  • 电源管理：在电池供电的设备中，使用其低导通电阻特性以降低功耗，延长电池使用寿命。
  • 开关电源：适用于DC-DC转换器中，作为开关元件，实现高效的能量转换。
  • 逻辑电平控制：在数字电路中，用于逻辑信号的开关和控制，适合于微控制器、单片机等领域的应用。
  • 小型电机驱动：即使在高负载情况下，该MOSFET也能提供稳定的性能，是驱动小型电机（如风扇和泵）的理想选择。

总结

总的来说，BSD235CH6327XTSA1是一款功能齐全、高性能的MOSFET阵列，具备了低功耗、高效率和宽工作温度范围的优良特性。这一产品的推出，丰富了英飞凌在MOSFET领域的产品线，为设计工程师提供了更多的设计自由度和灵活性。无论是在电源管理、逻辑控制还是驱动应用中，BSD235CH6327XTSA1都是一个理想的选择，能为现代电子产品的设计与性能提升做出贡献。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.