WMSIC Electronic Components

Infineon SPD02N80C3

ModelSPD02N80C3
PackagePG-TO252-3
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon SPD02N80C3
Type
INFINEON
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
SPD02N80C3
Electronic Component
1
Package
PG-TO252-3
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.481g
Electronic Component
1
Electronic Component
BM0106474245
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
42W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
800V
Capacitor(Ciss)
290pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SPD02N80C3 产品概述

SPD02N80C3 是英飞凌(Infineon)推出的一款高耐压N沟道功率场效应管(MOSFET),适用于中低功率、高压开关应用。器件采用TO-252(DPAK)封装,结合了800V耐压与较小的输出电容特性,适合离线开关电源、反激/正激变换器、LED驱动及其他需要高压开关但电流要求不大的场合。

一、主要参数一览

  • 型号:SPD02N80C3
  • 品牌:Infineon(英飞凌)
  • 极性:N沟道(单个)
  • 漏源电压 Vdss:800 V
  • 连续漏极电流 Id:2 A
  • 导通电阻 RDS(on):2.7 Ω @ Vgs = 10 V(测试电流 1.2 A)
  • 阈值电压 Vgs(th):3.9 V @ Id = 0.12 mA
  • 输入电容 Ciss:290 pF
  • 输出电容 Coss:13 pF
  • 栅极电荷 Qg:16 nC @ Vgs = 10 V
  • 功耗 Pd:42 W(封装/环境条件下的额定耗散)
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 封装:PG-TO252-3(DPAK,表面贴装)

二、性能与特点解析

  1. 高耐压(800 V):适合直接用于交流市电侧或高压母线侧的开关器件。
  2. 低输出电容(Coss = 13 pF):在高压开关中能显著降低开关损耗和能量回收需求,利于快速开关和减小开关应力。
  3. 中等栅极电荷(Qg = 16 nC):对驱动电路有一定要求,驱动器需能在所需开关频率下提供足够的电流以快速充放栅极。
  4. 较高阈值(Vgs(th) ≈ 3.9 V):器件在低电压驱动下导通并不充分,建议采用10 V门极驱动以达到标称 RDS(on) 和更低损耗。
  5. 较大导通电阻(2.7 Ω):意味着在导通电流达到安培量级时导通损耗显著,因此器件更适合用于低电流或以开关性能为主的场景,而非大电流低压导通替换。

三、典型应用场景

  • 离线开关电源(反激式、半桥、准谐振等)中的高压开关管
  • LED恒流驱动、电源初级侧开关
  • 工业控制中高压但低/中等电流的开关应用
  • 需要快速关断与低开关损耗的高压断路或保护电路

四、使用建议与设计注意事项

  1. 驱动电压:为获得标注的低RDS(on),应采用标准的10 V门极驱动电压;在驱动能力不足时选用驱动器或提升门极驱动能力以减少开关损耗。
  2. 门极阻抗与阻尼:栅极电荷较大时,建议在门极串联适当的门极电阻(根据开关速度与振荡抑制权衡选择)以控制开关速度并减少振荡及电磁干扰。
  3. 热管理:封装为DPAK,Pd 标称功耗需结合实际PCB散热、焊盘面积及环境温度进行热仿真与降额计算。大电流或高占空比工况需增加散热铜箔或外部散热措施。
  4. 开关布局:利用较小的输出电容可以降低开关能量,但同时应注意布局中回路电感和寄生电容对dv/dt和尖峰电压的影响,必要时配合RCD钳位或缓冲网络。
  5. 保护措施:在高压脉冲或反向恢复条件下,建议加装适当的过压、过流保护与RC缓冲,防止因尖峰而触发器件应力超限。

五、封装与可靠性

SPD02N80C3 提供PG-TO252-3(常见为DPAK)表面贴装封装,适合自动化贴装工艺。封装在保证良好焊盘和热铜层的情况下,可支持较好的散热路径。器件的工作温度范围为-55 ℃ 至 +150 ℃,适应严苛工业环境,但在设计时仍需考虑长期热循环和热抑制策略。

六、选型建议

  • 若应用需要800 V 耐压且电流在单安培级或更低、并优先考虑开关速度与较低开关损耗,SPD02N80C3 是合适选择。
  • 若系统运行电流较高或要求极低导通损耗,应考虑更低RDS(on)的高压MOSFET或采取并联与更严格的散热设计。
  • 在选型与最终设计前,务必参考英飞凌官方数据手册获取详尽的浪涌、脉冲、热阻及SOA信息,并结合实际工作条件做降额与热仿真分析。

以上为SPD02N80C3的产品概述与应用提示。详细电气特性、极限参数及典型波形请参照英飞凌的官方数据手册以完成最终设计验证。

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