WMSIC Electronic Components

Infineon ESD131B1W0201E6327

ModelESD131B1W0201E6327
PackageWLL-2-3
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon ESD131B1W0201E6327
Type
INFINEON
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
ESD131B1W0201E6327
Electronic Component
1
Package
WLL-2-3
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.008g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.23pF
Electronic Component
BM0258853536
Operating Temperature
55℃~+125℃
Voltage
13.8V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD131B1W0201E6327 — 产品概述

一、产品简介

ESD131B1W0201E6327 是英飞凌(Infineon)推出的一款单路双向静电放电(ESD)保护器件,封装为 WLL-2-3。器件具有高度对称的 I/V 特性、极低的结电容和良好的钳位性能,专为要求高速信号完整性同时需要可靠过电压/静电保护的电子接口设计。器件在宽温度范围(-55℃ 至 +125℃)内稳定工作,并满足多项工业级抗扰度标准,适用于便携设备、通信接口和工业控制等领域。

二、主要规格与电气特性

  • 极性:双向(对称 I/V 特性)
  • 反向截止电压(Vrwm):5.5 V
  • 击穿电压(VBR):8 V(典型)
  • 钳位电压(Vclamp):13.8 V(在 Ipp 条件下)
  • 峰值脉冲电流(Ipp):3.5 A @ 8/20 μs
  • 峰值脉冲功率(Ppp):24 W @ 8/20 μs
  • 反向电流(Ir):1 nA(静态微漏)
  • 结电容(Cj):0.23 pF(极低寄生电容,利于高速信号)
  • 通道数:单路
  • 工作温度:-55 ℃ 至 +125 ℃
  • 防护等级/认证:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)
  • 类型:ESD 保护器件
  • 封装:WLL-2-3(微小封装,便于高密度 PCB 布局)

三、产品特点与优势

  • 双向保护:能够对正负极性瞬态进行对称钳位,适用于差分对或双向信号线。
  • 低电容:0.23 pF 的结电容对高速数据线影响极小,可最大限度降低带宽和信号完整性的损失。
  • 优异的钳位能力:在 8/20 μs 标准脉冲下,13.8 V 的钳位电压能有效限制过压对后端器件的冲击。
  • 低漏电流:1 nA 的微小静态漏电利于低功耗系统应用。
  • 宽温度与工业级抗扰度:适合工业环境与长期可靠性要求的应用场景。
  • 小型封装:WLL-2-3 封装适合空间受限的接口与多通道保护方案。

四、典型应用

  • USB、USB-C、USB3.x 等高速接口的端口保护(单线路保护或配合成对使用)
  • HDMI、DisplayPort 等视频接口的次级保护(与匹配器件组合)
  • 工业差分信号(如 RS-485/RS-422)和串行数据线保护
  • 移动设备、笔记本、平板等外部接口的 ESD 防护
  • 无线模块或射频前端中对敏感控制线的保护(低电容优势明显)

五、PCB 布局与使用建议

  • 尽量靠近受保护的连接器或引入点放置器件,以最短路径引导瞬态电流到地。
  • 确保从器件到接地层/接地垫的回流路径尽可能短、低感抗,避免走长回流环路。
  • 对差分对或双线接口,按信号线逐条放置单路器件;若需要对地对称保护,可采用两个器件分别保护。
  • 为保证峰值脉冲能力与热耗散,布线应避免过细细长铜线;必要时在器件附近留足铜面积作为散热与回流。
  • 在多通道保护时,保持器件间隔和接地连通性,避免相互耦合引起的串扰。

六、可靠性与合规

ESD131B1W0201E6327 通过 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5 等常用抗扰度测试要求,适合用于需要通过 EMC/ESD 认证的产品设计。器件额定的温度范围和低漏电特性也有利于在苛刻环境下长期稳定运行。

七、选型建议

  • 若系统工作电压接近 5 V(或带有 ± 极性瞬态),且需保护高速数据线,Vrwm=5.5 V 的双向器件是合适选择。
  • 对于更高能量的浪涌或多次脉冲场景,注意器件的 Ipp 和 Ppp 限制,必要时采用更高能量等级的器件或并联/级联保护方案(并联需注意一致性与热均衡)。
  • 若信号完整性为首要考量(USB/高速接口),优先选择低结电容产品(本器件 Cj=0.23 pF)。
  • 对于空间受限设计,WLL-2-3 微小封装可节省 PCB 面积,但需严格按照厂家推荐的焊盘/回流工艺实现可靠焊接。

八、总结

ESD131B1W0201E6327 以其双向保护、低结电容、优良钳位性能和工业级抗扰能力,适合用于需要兼顾高速信号完整性与可靠过电压保护的单通道接口。合理的 PCB 布局和对峰值能量等级的评估可确保器件在实际系统中发挥最佳保护效果。若需覆盖多通道或更高浪涌能量场景,请在系统层面对保护方案进行扩展和验证。

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