WMSIC Electronic Components

Infineon FM24CL16B-GTR FM24CL16B

ModelFM24CL16B-GTR
PackageSOIC-8
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon FM24CL16B-GTR
Type
INFINEON
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
FM24CL16B-GTR
Electronic Component
1
Package
SOIC-8
Electronic Component
FRAM
Electronic Component
0.302g
Electronic Component
1
Electronic Component
BM0234638759
Electronic Component
16Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.65V
Operating Current
300uA
Current
3uA
Interface Type
I2C
Electronic Component
100000000000000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FM24CL16B-GTR 产品概述

一、产品简介

FM24CL16B-GTR 是英飞凌(Infineon)旗下的 16 Kbit 串行 F-RAM(铁电随机存取存储器),采用 I2C 总线接口、SOIC-8 封装。该器件以极高的擦写寿命、快速的写入响应和极低的待机功耗著称,适合频繁写入且要求数据在掉电时可靠保存的嵌入式系统与工业设备。

二、主要参数与性能亮点

  • 存储容量:16 Kbit(2 KB)
  • 接口类型:标准 I2C(最高时钟频率 1 MHz,Fast-mode Plus)
  • 供电电压:2.7 V ~ 3.65 V
  • 工作电流:约 300 μA(典型)
  • 待机电流:约 3 μA(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 擦写寿命:1×10^14 次(约 100,000,000,000,000 次)
  • 数据保持(TDR):约 151 年
  • 封装:SOIC-8
    这些指标使得 FM24CL16B 在需要高耐久与长期可靠性的应用中具有明显优势。

三、优势与技术特点

  • 即时写入:F-RAM 可像读操作一样快速完成写入,无需像 EEPROM 那样进行整页擦写或等待写完成,因此延迟低、实时性好。
  • 极高耐久性:10^14 次级别的擦写寿命,基本消除写入磨损限制,适合频繁更新的计数器、日志等用途。
  • 极低待机功耗:3 μA 待机电流利于电池供电或低功耗系统的长时间待机。
  • 非易失性:断电后数据保持期长达数十年,不依赖电池或超级电容维持数据。
  • 简单接口:兼容标准 I2C,便于与主控 MCU 或 FPGA 集成。

四、典型应用场景

  • 工业数据记录器、事件日志、计数器与配置参数存储;
  • 电池供电或能量受限设备中的非易失性快速存储;
  • 需要频繁小数据写入的场合,如传感器采样缓存、系统状态快照;
  • 取代 EEPROM 的场景,减少因写寿命耗尽导致的可靠性问题;
  • 汽车电子、计量仪表、医疗设备等对耐久性和数据保持有高要求的行业。

五、设计与使用建议

  • 电源与去耦:在 VCC 与 GND 之间放置 0.1 μF 陶瓷去耦电容,靠近器件引脚,以抑制瞬态噪声。
  • I2C 拉高:根据总线速率和总线容量选用合适的上拉电阻(常见 2.2 kΩ ~ 10 kΩ),1 MHz 工作时通常使用较小阻值以满足上升时间要求。
  • 地址与引脚处理:确认封装的地址引脚或器件地址设置,未使用引脚应按手册建议拉至确定电平以避免总线冲突。
  • 电气保护:在易受干扰或有静电风险的环境中考虑增加简单的串联阻抗、TVS 或滤波,以保护 SDA/SCL 引脚。
  • 写入策略:虽然 F-RAM 不需要磨损管理,但仍建议合理安排写入时序与总线仲裁,避免总线拥塞或主控重复写入导致性能下降。
  • 供电序列与热插拔:遵循器件电源与 I/O 电压兼容规则,避免在不符合规范的热插拔条件下操作。

六、封装与采购信息

FM24CL16B-GTR 常见为 SOIC-8 小型封装,适合标准 PCB 工艺装配。采购时请关注器件批次、温度等级与原厂认证渠道,确保获得符合工业温度与规格的正品货源。

总结:FM24CL16B-GTR 以其快速、耐久、低功耗与易用的 I2C 接口,为需要高频写入和长期数据保持的系统提供了一种可靠且维护成本低的非易失性存储解决方案。设计时注意总线布线、电源去耦与合适的上拉电阻配置,可充分发挥其性能优势。

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