WMSIC Electronic Components

Infineon BSO150N03MD G BSO150N03MD

ModelBSO150N03MD G
PackageDSO-8
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon BSO150N03MD G
Type
INFINEON
Unit
Electronic Component
Minimum package
2500

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSO150N03MD G
Electronic Component
1
Package
DSO-8
Electronic Component
2 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.26g
Electronic Component
1
Electronic Component
BM0230658800
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2W
Electronic Component
2500
Voltage(Vdss)
30V
Capacitor(Ciss)
970pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSO150N03MD G 产品概述

一、概述

BSO150N03MD G 是英飞凌(Infineon)推出的一款双通道 N 沟道 MOSFET,集成在 DSO-8 封装中,基于 OptiMOS 技术打造。器件面向中低压、高效率电源与功率开关应用,提供低导通损耗与良好的开关性能,适合要求体积小、热性能可控的设计场景。

二、主要参数

  • 通道数:2 个 N 沟道
  • 漏源电压 Vdss:30 V
  • 连续漏极电流 Id:9.3 A
  • 导通电阻 RDS(on):12.5 mΩ @ Vgs = 10 V
  • 耗散功率 Pd:2 W(与散热条件相关)
  • 阈值电压 Vgs(th):2 V(典型)
  • 总栅极电荷 Qg:12.6 nC @ Vgs = 10 V
  • 输入电容 Ciss:970 pF
  • 输出电容 Coss:340 pF
  • 反向传输电容 Crss:20 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:DSO-8(双通道封装)

三、特点与优势

  • 低导通电阻:12.5 mΩ(10 V 驱动)在导通损耗与热升中表现优异,适合高电流路径以降低 conduction loss。
  • 平衡的开关性能:Qg = 12.6 nC 和 Ciss/Coss/Crss 组合使器件适合中高频开关(例如同步整流与升降压转换),在开关损耗与驱动功率之间取得合理折中。
  • 紧凑双通道封装:DSO-8 内置两路 N 沟道,便于在半桥、推挽或并联配置中节省 PCB 面积并缩短布线长度。
  • 宽温度范围与工业级工作温度,适合车载与工业环境(请根据实际散热条件评估长期可靠性)。

四、典型应用

  • 同步降压/升压 DC-DC 转换器(作为高端或低端开关器件)
  • 电源路径控制与负载开关
  • 电机驱动与功率级开关(中小功率电机)
  • 电池管理与充放电控制
  • 通信与工业电源模块

五、设计与使用建议

  • 驱动电压:为获得标称 RDS(on),建议使用接近 10 V 的栅极驱动电压;若受限于逻辑电平驱动,应评估在 5 V 驱动下的表现。
  • 驱动器选择:Qg = 12.6 nC 表明需要适度的驱动能力,选择低阻抗驱动器并在必要处串联栅极电阻以控制 dv/dt 与振铃。
  • 散热管理:封装 Pd = 2 W 为典型额定值,实际耗散受 PCB 铜箔、过孔与环境影响,推荐增加散热铜箔与热孔以降低结温。
  • 布局注意:将高电流回路(源-漏路径)尽量缩短并增大铜厚,栅极走线短且与开关节点隔离,靠近器件放置去耦电容。
  • 并联与匹配:若需并联使用,注意匹配 RDS(on) 与散热条件,避免单通道过载。

六、可靠性与封装信息

DSO-8 封装提供良好的机械强度与热传导路径,封装内含两路 N 沟道以节省空间。器件工作温度范围为 -55 ℃ 至 +150 ℃,在高温应用中应严格控制结温以保证长期可靠性。建议在生产使用前参考英飞凌完整数据手册与应用笔记,确认管脚定义与详尽热阻参数。

七、总结

BSO150N03MD G 以 30 V 耐压、9.3 A 电流能力和 12.5 mΩ 的低导通电阻,结合适中的开关电荷与电容特性,适合要求低损耗与紧凑布局的电源与开关应用。良好的封装和温度范围使其在工业与消费类电源设计中具备竞争力。欲获取完整电气特性曲线、封装图与焊接建议,请参考英飞凌官方数据手册。

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