Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon BAT1502ELE6327XTMA1
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon BAT1502ELE6327XTMA1
- Type
- INFINEON
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BAT1502ELE6327XTMA1
- Electronic Component
- 1
- Package
- SOD-882
- Electronic Component
- Schottky Diode
- Electronic Component
- Signal =< 200m A(Io)
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM0084328484
- Type
- Surface Mount
- Package / Housing
- 2-XDFN
- Diode Type
- Electronic Component
- Operating Temperature
- 55°C ~ 150°C
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT1502ELE6327XTMA1 产品概述
产品简介
BAT1502ELE6327XTMA1是一款高性能肖特基二极管，专为各种电子应用设计，特别是那些对开关速度和低正向电压降有严格要求的场合。此器件由英飞凌（Infineon）制造，封装采用小型表面贴装型（TSLP-2-19），方便在空间受限的电路板上实现有效安装。
关键参数
BAT1502的主要参数如下：
- 二极管类型：肖特基二极管
- 最大反向电压（Vr）：4V
- 平均整流电流（Io）：110mA（DC）
- 正向电压（Vf）：410mV @ 10mA
- 反向泄漏电流：5µA @ 1V
- 电容值：350pF @ 0V，1MHz
- 工作温度范围：-55°C ~ 150°C
性能特征
肖特基二极管因其独特的结构，具备较低的正向压降（Vf），使其在开启时损耗极少，适用于高效率的功率管理和快速切换应用。BAT1502在正向电流为10mA时，其正向压降仅为410mV，相较于传统硅二极管，可以显著降低能量损耗，从而提高整体系统效率。
此外，其反向电流（泄漏电流）在1V的条件下仅为5µA，体现出该器件的优秀性能，适合用于需要严格控制泄漏电流的场合，比如低功耗电源和信号处理电路。
应用场景
BAT1502广泛应用于以下几个领域：
- 电源管理：由于其低正向电压降和杰出的反向性能，适合在电源开关、整流电路和反向保护中使用，可以有效提升电源转换效率。
- LED驱动：在LED照明系统中，可以用作电流整流器，提供稳定的电流，确保LED长时间稳定工作。
- 射频和高速应用：其小信号特性和快速反应使其非常适合应用于射频电路、混合信号处理以及快速开关电源。
- 电池保护电路：在蓄电池的充电和放电保护中，BAT1502所具备的低反向泄漏电流可有效防止电池过放及反向充电，提高电池的使用寿命和安全性。
结论
综上所述，BAT1502ELE6327XTMA1是一款性能卓越、应用灵活的肖特基二极管，凭借其低正向电压、高反向电压承载能力及小型封装设计，满足了现代电子设备在高效能和小型化上的多重需求。其广泛的应用潜力尤其适合先进的电源管理、LED驱动和高频信号传输领域。同时，其宽广的工作温度范围也使其适合在各种苛刻环境中稳定运行，是设计工程师值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
