Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述
IRFS3607TRLPBF 是一款高性能的N通道MOSFET,由全球知名的半导体制造商——英飞凌(Infineon)出品。该器件将现代MOSFET技术与优越的电气特性相结合,为高效能应用提供了强大支持。其关键参数包括额定漏源电压为75V,连续漏极电流可达80A,以及在25°C时的额定功率耗散达到140W。这些参数使得IRFS3607TRLPBF特别适用于高功率转换、开关电源、以及电机驱动等苛刻工作环境。
技术特性
高漏源电压和电流能力:IRFS3607TRLPBF的漏源电压(Vdss)为75V,可很好地满足多种电力转换和分配系统的需求。其最大连续漏极电流(Id)为80A,保证了在高负载条件下的稳定性和可靠性。
低导通电阻:该MOSFET在Vgs=10V及Id=46A时,最大导通电阻(Rds(on))为9毫欧,这意味着在通电时产生的热量非常少,从而减少了功耗,提高了能效,同时减轻了散热设计的压力。
宽工作温度范围:IRFS3607TRLPBF的工作温度范围为 -55°C至175°C,从而使其在极端环境下也能稳定工作,这对工业级应用特别重要。
栅极驱动和输入电容特性:该器件在10V的门压下,其栅极电荷(Qg)最大值仅为84nC,这表明其能够以较低的驱动功率快速切换。同时,输入电容(Ciss)在50V下的最大值为3070pF,优化了高频性能,减少了开关延迟,适用于对响应时间有要求的应用。
高功率耗散能力:具有高达140W的功率耗散能力,使得IRFS3607TRLPBF非常适合高功率及高效率的场合,如DC-DC转换器、UPS、LED驱动电源等。
封装与安装
IRFS3607TRLPBF采用D2PAK封装,符合TO-263-3标准,这种表面贴装(SMD)设计使得在PCB的布局中更加灵活,能够有效降低焊接过程中的工艺难度,同时提升散热性能。D2PAK设计也保证了较大的表面接触面积,从而提高散热效率,适应高功率应用下的冷却要求。
应用领域
IRFS3607TRLPBF广泛应用于各种高功率电源管理和转换领域,具体包括:
总结
综上所述,IRFS3607TRLPBF是一款具有卓越性能的N通道MOSFET,凭借其高电压和电流能力、低导通电阻、宽工作温度范围和良好的开关特性,成功满足了高端电力电子应用的需求。它的设计考虑到了现代电源管理系统对性能和可靠性的苛刻要求,是开发高效能电源解决方案过程中的理想选择。无论是在电子产品设计还是直接应用中,IRFS3607TRLPBF均展现出强大的应用潜力和高效的性能表现。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products