WMSIC Electronic Components

Infineon BTT6030-2ERA BTT6030

ModelBTT6030-2ERA
PackageTDSO-14
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BTT6030-2ERA
Type
INFINEON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BTT6030-2ERA
Electronic Component
1
Package
TDSO-14
Type
Switch
Electronic Component
Power Electronic Switch
Electronic Component
0.82g
Electronic Component
1
Channel Count
2
Features
Integrated Charge Pump
Electronic Component
BM0209680682
Resistor
32mΩ
Operating Temperature
40℃~+150℃
Operating Voltage
5V~36V
Current
6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BTT6030-2ERA 产品概述

一、产品简介

BTT6030-2ERA 是英飞凌(Infineon)推出的一款双通道高侧功率开关,封装为 TDSO-14,面向需要可靠负载驱动与多种保护功能的应用场景。器件工作电压范围宽(5V~36V),每通道最大连续电流可达 6A,导通电阻约 32mΩ,同时集成过热保护(OTP)、过压保护(OVP)、短路保护(SCP)和欠压保护(UVP),适合为直流电机、继电器线圈、灯源及其他中小功率感性或阻性负载供电。

二、主要特性

  • 双通道高侧开关,通道数:2
  • 工作电压:5V 至 36V,适应宽范围供电
  • 最大连续电流:6A(单通道)
  • 导通电阻(RDS(on)):约 32mΩ(典型)
  • 输入控制逻辑:高电平有效,便于与 MCU 或逻辑电平直接接口
  • 保护功能:过热保护(OTP)、过压保护(OVP)、短路保护(SCP)、欠压保护(UVP)
  • 工作温度范围:-40℃ ~ +150℃
  • 封装:TDSO-14

三、保护与行为说明

内建的保护措施可显著提升系统可靠性:

  • 短路保护(SCP):在检测到过大的瞬态或持续短路电流时限制或断开输出,防止器件或负载损坏。
  • 过热保护(OTP):当结温超过安全阈值时触发保护,通常为关断并在温度恢复后自动重试(具体行为以器件数据手册为准)。
  • 过压/欠压保护(OVP/UVP):在输入电压异常时保护负载与内部电路,避免工作在不安全电源条件下。 这些保护机制允许在恶劣工况下维持系统安全,但在设计时仍需考虑合适的散热与外围保护元件。

四、典型应用场景

  • 汽车电子中的辅助负载驱动(车内小功率执行器、阀门、继电器驱动等)
  • 工业控制与楼宇自动化(电磁阀、泵、风扇或步进/直流电机驱动的高侧开关)
  • LED 阵列或照明模块(需注意热管理与电流限制)
  • 电源分配与多路开关控制模块

五、设计与布局建议

  • 电源去耦:在器件 VIN 端靠近引脚放置低 ESR 电容(陶瓷 + 钽电容或电解并联),抑制瞬态电压尖峰。
  • 感性负载:对于电机或继电器等感性负载,应在负载侧或电源侧并联合适的续流二极管或使用 RC/TVS 抑制器,以抑制反向瞬态。
  • 散热处理:TDSO-14 封装散热能力有限,建议增大 PCB 铜箔面积(散热层与散热焊盘),给器件提供充足的散热通路,特别是在接近 6A 连续工作时需要热沉或多层铜箔。
  • 控制接口:输入为高电平有效,适配常见 MCU(建议核对数据手册中的输入阈值与上拉/下拉要求)。
  • 布线与 EMI:尽量缩短功率回路,减小寄生电感;对高速开关或感性负载,应考虑滤波与增加共模抑制措施。

六、可靠性与封装信息

TDSO-14 封装在体积与散热之间做平衡,适用于空间受限但需一定功率处理能力的场合。器件额定工作温度 -40℃ 至 +150℃,在高温环境下必须注意热量累积与可靠性退化,长期工作时建议余量设计(电流、温度)。

七、选型与替代建议

在选型时,若系统需更低 RDS(on) 或更高电流能力,应考虑更大功率封装或采用外部 MOSFET;如需更多通道或额外诊断功能,可比较英飞凌同系列或竞品的多通道高侧开关产品,参考具体数据手册进行器件级对比。

八、总结

BTT6030-2ERA 是一款集成度高、保护完备的双通道高侧开关,适合 5V~36V 电源系统中驱动中小功率负载的场景。合理的 PCB 散热设计、适当的外部浪涌/续流保护和遵循器件手册的使用规范,能最大化发挥其性能与可靠性。欲获取详细电气参数、引脚定义和保护逻辑时,请参考英飞凌官方数据手册以便完成最终设计验证。

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