WMSIC Electronic Components

Infineon IRS10752LTRPBF

ModelIRS10752LTRPBF
PackageSOT-23-6
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRS10752LTRPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRS10752LTRPBF
Electronic Component
1
Package
SOT-23-6
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.054g
Electronic Component
1
Features
Built-in Diode
Electronic Component
BM0230589578
Operating Temperature
40℃~+125℃
Operating Voltage
10V~18V
Load Type
MOSFET
Driver
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRS10752LTRPBF 产品概述

一、概述

IRS10752LTRPBF 是英飞凌(Infineon)面向单颗 MOSFET 的高边门极驱动器,封装为 SOT-23-6。器件工作电压范围为 10V ~ 18V,具备欠压保护(UVP)功能与极低静态电流特性,适合对体积、效率与成本都有一定要求的高边开关场合。单通道设计、较强的瞬态驱动能力与宽工作温度范围,使其在中小功率电源、伺服与汽车电子等领域具有良好适配性。

二、主要参数

  • 驱动配置:高边(single high-side gate driver)
  • 负载类型:MOSFET
  • 驱动通道数:1 路
  • 灌电流 (IOL):240 mA(下拉/吸电流)
  • 拉电流 (IOH):160 mA(上拉/源电流)
  • 工作电压:10 V ~ 18 V
  • 上升时间 (tr):85 ns
  • 下降时间 (tf):40 ns
  • 传播延迟 tpLH:140 ns
  • 传播延迟 tpHL:215 ns
  • 欠压保护:有(UVP)
  • 静态电流 (Iq):100 µA
  • 工作温度:-40 ℃ ~ +125 ℃(Tj)
  • 封装:SOT-23-6
  • 品牌:Infineon(英飞凌)

三、性能亮点与设计意义

  • 高峰值驱动能力:IOL = 240 mA、IOH = 160 mA 表明在开关瞬态时能够对 MOSFET 门极进行快速充放电,有利于缩短开关过渡时间,降低开关损耗。由于上下拉电流不对称,器件在关断(下拉)时通常能更快地清除门电荷,从而获得更快的关断边沿(配合 tf = 40 ns)。
  • 时序与延迟:tpLH = 140 ns、tpHL = 215 ns 提供了器件的传输延迟参考,便于系统级时序匹配与并联器件的同步控制。
  • 低静态电流与 UVP:Iq = 100 µA 显著降低待机功耗;内置欠压保护在供电不足时阻断无效驱动,防止 MOSFET 处于半导通区造成损耗或误动作。
  • 宽温区与小封装:-40 ℃ ~ +125 ℃ 的结温范围配合 SOT-23-6 小体积封装,使得该器件适合商用/工业级及部分汽车边缘应用的空间受限设计。

四、典型应用场景

  • 同步整流或非隔离降压转换器的高边开关驱动
  • 电池管理系统与电源开关(高边负载断开)
  • 电机驱动前端的功率开关控制(驱动单颗或级联 MOSFET)
  • 汽车车载电源及辅助电源(在符合温度与电压要求下)
  • LED 驱动及其他需要高边开关的嵌入式电源模块

五、PCB 布局与使用建议

  • 电源滤波:在 VCC 近侧放置 100 nF 陶瓷旁路电容,尽量靠近器件 VCC 与 GND 引脚,减小寄生电感与回路面积。
  • 门极电阻:为控制开关边沿、抑制振铃并限制瞬态电流,建议在门极与 MOSFET 之间并联小阻值门极电阻(典型 5 Ω ~ 100 Ω,依据 MOSFET gate charge 与系统 EMI 要求调整)。
  • 回流路径短:将驱动器输出到 MOSFET 门的走线尽量短且宽,以减小寄生电感;驱动器地与功率地在近处形成星形或短回路。
  • 热管理:SOT-23-6 封装散热能力有限,注意功率损耗(由静态Iq 与开关频率相关的动态损耗组合),在高频或高温环境下需检查结温并考虑散热或降额。
  • 抑制器件应对:在可能出现较大 dv/dt 或尖峰电压的应用中,适当采用 RC 或 RCD 吸收网络、TVS 管保护驱动电源,防止器件误动作或损坏。

六、选型与注意事项

  • 核心匹配:在选定 MOSFET 时重点核算 MOSFET 的门电荷(Qg)与驱动器的峰值电流与上/下降时间之间的匹配,确保开关损耗与 EMI 在可接受范围。
  • 电源容限:保证驱动工作电压稳定在 10 V ~ 18 V 范围内;在使用电池或变动电源时设计合适的稳压或过压/欠压保护。
  • 功率与温度预算:结合工作频率评估器件在目标工作条件下的平均和瞬态功耗,留足热裕度。
  • 系统保护:尽管器件集成了 UVP,但系统层面仍需考虑短路检测、过温保护等更全面的保护机制。

七、适用建议(总结)

IRS10752LTRPBF 提供了一种体积小、静态功耗低且瞬态驱动能力适中的高边单通道门极驱动方案。适用于需要在受限空间内实现高边 MOSFET 快速、可靠驱动的场合。设计时应关注门极驱动与 MOSFET Qg 的匹配、合理的 PCB 布局与旁路策略以及系统级的过压/过温防护,以保证长期的可靠性与最佳开关性能。

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