Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon IRF7342TRPBF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Infineon IRF7342TRPBF
- Type
- INFINEON
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- IRF7342TRPBF
- Electronic Component
- 1
- Package
- SO-8
- Electronic Component
- 2 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.286g
- Electronic Component
- 1
- Electronic Component
- BM0000287928
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：IRF7342TRPBF
一、基本信息
IRF7342TRPBF 是一款由英飞凌（Infineon）生产的 P 沟道场效应管（MOSFET），封装为 8-SOIC（0.154"，3.90mm 宽）。该器件设计用于高效电源管理和逻辑电平开关，适用于各种电子应用，特别是那些需要高效能和高可靠性的场合。
二、主要参数
FET 类型与功能
- 该器件包含两个 P 沟道场效应管，每个管均具备良好的开关特性，适合用于逻辑电平控制。其逻辑电平门特性意味着可以用较低的栅极电压控制高功率设备，非常适合于低电压微控制器或数字信号处理器（DSP）直接驱动。
电气特性
- 漏源电压（Vdss）: 最大55V，确保在高电压运作环境中稳定工作。
- 连续漏极电流（Id）: 3.4A，适用于需要适度电流负载的应用。
- 导通电阻（Rds(on)）: 最大105毫欧在3.4A和10V下，这一低电阻特性使其在开关过程中能减少功耗及发热。
- 阈值电压（Vgs(th)）: 最大1V（@250µA），使该器件对低电压敏感，适于低功耗电路。
- 栅极电荷（Qg）: 最大38nC（@10V），这表明器件在进行开关操作时所需的输入能量较低。
- 输入电容（Ciss）: 最大690pF（@25V），这一特性影响到器件的开关速度和平衡电路的稳定性。
功率和工作温度
- 最大功率为2W，提供了良好的功率承受能力和散热性能。
- 工作温度范围为-55°C至150°C，展示出了极高的环境适应性，因此适用于严苛的工作条件及广泛的工业应用。
三、应用场景
IRF7342TRPBF 产品具有广泛的应用，包括但不限于以下领域：
- 电源管理: 适用于交流-直流（AC-DC）和直流-直流（DC-DC）变换器设计，能够提供高效的电流开关性能。
- 电机驱动: 该 MOSFET 可以担当电机驱动电路中的开关元件，对负载进行高效控制和管理。
- 逻辑电平控制应用: 由于其低Vgs(th)，可直接由较低电平的逻辑芯片驱动，从而简化电路设计。
- 充电和电池管理: 适合用于电池充电和管理电路，帮助实现有效的电源转换和分配。
四、总结
IRF7342TRPBF 是一款高效、可靠的 P 沟道 MOSFET，凭借其良好的电气性能和环境适应性，使其成为现代电子电路设计中的优选器件。其逻辑电平门功能、较低的导通电阻以及广泛的工作温度范围为设计者提供了灵活的电路设计选项，能够满足多种高功率和高性能的应用需求。无论是在工业设备、消费电子还是汽车电子中，IRF7342TRPBF 都展现出卓越的性能表现，是构建高效、安全电源系统的重要组成部分。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
