Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品简介
IRF7416TRPBF 是一款高性能的 P 沟道金属氧化物半导体场效应管(MOSFET),由著名半导体制造商 Infineon(英飞凌)生产。该器件封装为 SO-8 形式,提供了极小的占板面积,适用于各种表面贴装应用。IRF7416TRPBF 的主要规格包括最大漏源电压 30V、最大连续漏极电流 10A 和最大功率耗散 2.5W,使其成为高效家电、工业控制和电源管理系统的理想选择。
技术规格
漏源电压 (Vdss): 30V,这使得该 MOSFET 能够在高达 30V 的应用环境中安全工作,适合多种电气方案。
连续漏极电流 (Id): 在 25°C 条件下可达 10A,确保了该器件在高负载情况下的稳定性与可靠性。
栅源极阈值电压 (Vgs(th)): 标称值为 2.04V @ 250µA,表明该器件在较低的栅源电压下能够导通,便于与低电压控制电路兼容。
漏源导通电阻 (Rds(on)): 最大值为 20毫欧 @ 5.6A,10V,出色的导通性能减少了在导通状态下的功耗,提升了系统的整体效率。
最大功率耗散: 在 25°C 条件下最大为 2.5W,保证了在高功率应用中可以有效管理热量。
工作温度范围 (TJ): 从 -55°C 到 150°C,允许器件在极端环境下可靠工作,适合各种应用场景。
电气特性
IRF7416TRPBF 的其他电气特性包括:
驱动电压: 最小 Rds(on) 和最大 Rds(on) 分别为 4.5V 和 10V,使得设计人员能够根据系统要求灵活选择驱动电压。
栅极电荷 (Qg): 最大值为 92nC @ 10V,低栅极电荷意味着在开关操作时更高的效率以及快速的开关时间。
输入电容 (Ciss): 最大值为 1700pF @ 25V,保证在射频和快速开关应用中能够减少交越延迟,提升性能。
Vgs (最大值): ±20V 的最大栅源电压范围,防止过电压对器件造成损坏。
应用
IRF7416TRPBF 特别适用于多种应用领域,包括但不限于:
电源管理: 用于 DC-DC 转换器和适配器中,能够在高负载下低损耗工作。
电机控制: 可以作为高速开关在电机驱动电路中工作,优化电机效率和响应性。
音频设备: 高效的放大器开关,使得音频设备可以实现更低的失真和更高的音质输出。
家电: 可用于智能家居和家电产品的功率开关,提升能效和安全性。
封装与安装
IRF7416TRPBF 采用业界标准的 SO-8 封装,尺寸紧凑,为表面贴装型设计,适合流行的 PCB 布局,降低占板面积,便于自动化焊接。
总结
总的来说,IRF7416TRPBF 是一款功能强大且高度可靠的 P 沟道 MOSFET IC,其设计和规格使其能够在众多应用中表现优异。无论是用于高效电源管理,还是在电机控制和音频设备中,IRF7416TRPBF 都为设计人员提供了出色的解决方案。凭借 Infineon 的高质量制造和严格的测试标准,它为电子设备的长寿命和稳定性提供了保障。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products