Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSC016N03MS G 为英飞凌 OptiMOS 系列 N 沟道功率 MOSFET,额定漏源电压 30V,连续漏极电流 100A,典型导通电阻 RDS(on)=1.6mΩ(VGS=10V、ID=30A)。栅极阈值电压 VGS(th) 约 1V,栅极总电荷 Qg=84nC(10V),输入电容 Ciss≈13nF,反向传输电容 Crss≈210pF(15V)。工作温度范围 -55℃ 至 +150℃,最大耗散功率 Pd=125W。封装为 TDSON-8-EP (5x6),适合高功率密度方案。
器件 Pd=125W 为测试条件下的参考值,实际散热能力高度依赖 PCB 铜箔面积、底部散热焊盘与热阻设计。建议在电源地平面与大型铜箔上布置热 vias,将封装底部的散热焊盘与散热层直接连接,以降低结-到-环境热阻,确保在高电流工作时结温受控。
Qg=84nC 与 Ciss=13nF 表明栅电荷与输入电容较大,要求驱动器具备较高峰值电流以缩短开关时间,避免开关损耗增加。推荐使用带有适当阻尼的门极电阻以控制振铃并满足 dv/dt 要求。RDS(on) 为 1.6mΩ 以 10V 驱动测量,若采用低电压驱动(如 6V)需评估导通损耗变化。
TDSON-8-EP (5x6) 提供裸露电极(EP)以优化热传导。布局时应保证大面积焊盘与多孔通至内部铜层,焊接工艺需控制底部焊盘温度与锡膏量以获得一致散热性能。
在需要更低开关损耗或更小 Qg 的场合,可在 OptiMOS 系列中比较不同型号;若系统要求更高电压或不同封装,也可参考相近电压等级的器件。并联使用时需注意门极驱动分配与热均衡,建议查看英飞凌完整数据手册以获取 SOA、Avalanche 能量及详细时序参数。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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