WMSIC Electronic Components

Infineon BSC016N03MS G BSC016N03MS

ModelBSC016N03MS G
PackageTDSON-8-EP(5x6)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon BSC016N03MS G
Type
INFINEON
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSC016N03MS G
Electronic Component
1
Package
TDSON-8-EP(5x6)
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.171g
Electronic Component
1
Electronic Component
BM0228561149
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
125W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSC016N03MS G 产品概述

一、主要性能与规格

BSC016N03MS G 为英飞凌 OptiMOS 系列 N 沟道功率 MOSFET,额定漏源电压 30V,连续漏极电流 100A,典型导通电阻 RDS(on)=1.6mΩ(VGS=10V、ID=30A)。栅极阈值电压 VGS(th) 约 1V,栅极总电荷 Qg=84nC(10V),输入电容 Ciss≈13nF,反向传输电容 Crss≈210pF(15V)。工作温度范围 -55℃ 至 +150℃,最大耗散功率 Pd=125W。封装为 TDSON-8-EP (5x6),适合高功率密度方案。

二、关键特性与优势

  • 极低导通电阻带来较小导通损耗,适用于高电流路径。
  • 30V 额定适合 12V/24V 汽车与工业电源系统的开关与同步整流。
  • OptiMOS 工艺兼顾导通与开关性能,适用于需要高效率的应用。
  • 紧凑 TDSON-8-EP 封装具备良好热路径,便于 PCB 散热设计。

三、热与功率管理

器件 Pd=125W 为测试条件下的参考值,实际散热能力高度依赖 PCB 铜箔面积、底部散热焊盘与热阻设计。建议在电源地平面与大型铜箔上布置热 vias,将封装底部的散热焊盘与散热层直接连接,以降低结-到-环境热阻,确保在高电流工作时结温受控。

四、驱动与开关设计注意事项

Qg=84nC 与 Ciss=13nF 表明栅电荷与输入电容较大,要求驱动器具备较高峰值电流以缩短开关时间,避免开关损耗增加。推荐使用带有适当阻尼的门极电阻以控制振铃并满足 dv/dt 要求。RDS(on) 为 1.6mΩ 以 10V 驱动测量,若采用低电压驱动(如 6V)需评估导通损耗变化。

五、典型应用场景

  • 同步整流与降压转换器(DC-DC)
  • 汽车电源开关与电机驱动前级(在 12V/24V 系统中)
  • 服务器与电信供电模块的主开关元件
  • 高效率功率分配与热敏负载开关

六、封装与机械要点

TDSON-8-EP (5x6) 提供裸露电极(EP)以优化热传导。布局时应保证大面积焊盘与多孔通至内部铜层,焊接工艺需控制底部焊盘温度与锡膏量以获得一致散热性能。

七、选型与替代建议

在需要更低开关损耗或更小 Qg 的场合,可在 OptiMOS 系列中比较不同型号;若系统要求更高电压或不同封装,也可参考相近电压等级的器件。并联使用时需注意门极驱动分配与热均衡,建议查看英飞凌完整数据手册以获取 SOA、Avalanche 能量及详细时序参数。

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