WMSIC Electronic Components

Infineon BSC011N03LSI

ModelBSC011N03LSI
PackageTDSON-8(5x6)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon BSC011N03LSI
Type
INFINEON
Unit
Electronic Component
Minimum package
5000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSC011N03LSI
Electronic Component
1
Package
TDSON-8(5x6)
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.464g
Electronic Component
1
Electronic Component
BM0228287929
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.5W
Electronic Component
5000
Voltage(Vdss)
30V
Capacitor(Ciss)
5.719nF
Gate (Qg)
68nC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSC011N03LSI 产品概述(Infineon)

一、概述

BSC011N03LSI 是英飞凌推出的一款低压大电流 N 沟增强型场效应管(MOSFET),适用于中高电流、低压差的电源和功率开关场合。器件在 TDSON-8 (5×6) 紧凑封装下提供极低的导通电阻与较高的电流承载能力,针对同步整流、DC-DC 变换器与电机驱动等场合进行了优化。

二、主要参数

  • 数量:1 个 N 沟道
  • 漏源电压 Vdss:30 V
  • 连续漏极电流 Id:100 A
  • 导通电阻 RDS(on):1.1 mΩ @ Vgs = 4.5 V
  • 最大耗散功率 Pd:2.5 W(封装限制,实际以 PCB 散热能力为准)
  • 阈值电压 Vgs(th):2 V
  • 总栅极电荷 Qg:68 nC
  • 输入电容 Ciss:5.719 nF
  • 反向传输电容 Crss:220 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:TDSON-8 (5×6)

三、性能特点与典型应用

  • 极低 RDS(on)(1.1 mΩ @4.5V)在低压高电流工况下可显著降低导通损耗,适合同步整流和主开关场合。
  • 较大的 Id(100 A)满足短时或持续高电流输出需求,但需配合良好的 PCB 散热设计以发挥性能。
  • 中等偏高的栅极电荷(68 nC)与较大的 Ciss 表明器件在高频切换时对驱动能力要求较高,适用于开关频率中低档(如几十 kHz 至数百 kHz)的功率变换。 典型应用包括:
  • 同步降压(Buck)转换器;
  • 负载开关与逆变器前端开关;
  • 电机驱动的低侧或高侧功率开关(配合驱动电路);
  • 汽车电子、工业电源模块(在满足热设计的前提下)。

四、驱动与开关考量

  • 由于 Qg = 68 nC 与 Ciss 较大,栅极驱动器需提供足够的瞬时电流以确保快速切换,否则将增加开关损耗与过渡热应力。例如在 100 kHz、10 V 驱动下,栅极驱动功耗约为 P = Qg × Vdrv × f ≈ 0.068 W;在更高频率下驱动损耗显著上升。
  • Crss = 220 pF 会引起明显的 Miller 效应,切换过程中需控制 dv/dt 或使用合适的门极电阻来避免振铃或误导通。
  • 推荐使用短且粗的走线、接近器件的门极驱动布局,并考虑隔离阻尼或 RC 缓冲以抑制尖峰。

五、热管理与 PCB 布局建议

  • 封装 Pd=2.5 W 指出器件在自由空气或标准试验条件下的耗散受限,实际应用中应通过 PCB 铜箔、散热垫和过孔导热至内层/背面大铜箔来提升散热能力。
  • 建议在器件下方或引脚间设置热沉焊盘和多条热通孔(thermal vias)直通内层或背铜层,保证连续大电流工况下结温受控。
  • 优化电源回路布局,最小化开关回路环路面积,采用 Kelvin 源连接以提高测量与驱动精度。

六、注意事项与总结

  • 在并联使用时应注意 RDS(on) 匹配与电流均流、门极驱动的一致性;必要时加入小阻抗或丝印以均流。
  • 器件对 ESD 和过压敏感,模块设计中应考虑 TVS 和栅极保护元件。
  • 总结:BSC011N03LSI 在低压高速大电流应用中具有优秀的导通性能,但需配合合理的驱动方案与严谨的热管理与 PCB 设计,方能发挥其低损耗、高效率的优势。购买与设计前建议参阅英飞凌原厂数据手册以获取完整电气特性曲线与最大额定值。

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