WMSIC Electronic Components

Infineon IRFS3306TRLPBF

ModelIRFS3306TRLPBF
PackageD2PAK
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRFS3306TRLPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRFS3306TRLPBF
Electronic Component
1
Package
D2PAK
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
1.66g
Electronic Component
1
Electronic Component
BM0095531252
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
230W
Electronic Component
Electronic Component
Electronic Component
800
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRFS3306TRLPBF 产品概述

1. 产品简介

IRFS3306TRLPBF 是由英飞凌(Infineon)公司生产的一款高性能 N 通道 MOSFET,旨在满足高效能电力转换和开关应用的要求。该器件采用表面贴装型封装(D2PAK),具有出色的热管理能力和高电流承载能力,使其在各种工业和消费类电子产品中广泛应用。该 MOSFET 具备60V的漏源电压(Vdss)、120A的连续漏极电流(Id),以及可高达230W的功率耗散(Tc),使其成为高功率应用的理想选择。

2. 主要参数特性

  • FET 类型: N 通道 MOSFET
  • 漏源电压 (Vdss): 60V
  • 连续漏极电流 (Id): 120A (在适当的散热条件下)
  • 驱动电压: 10V(用于最小和最大 Rds On)
  • 导通电阻 (Rds On): 最大值为4.2 毫欧,测试条件为75A,10V Vgs
  • 栅源阈值电压 (Vgs(th)): 最大值为4V(在150µA时测得)
  • 栅极电荷 (Qg): 最大值为120nC,测试条件为10V
  • 栅源电压绝对最大值 (Vgs): ±20V
  • 输入电容 (Ciss): 最大值为4520pF(在50V时测得)
  • 功率耗散 (Pd): 最大值为230W(在适当的散热条件下)
  • 工作温度范围: -55°C 至 175°C(结温 TJ)
  • 封装类型: D2PAK(TO-263-3封装)

3. 应用场景

IRFS3306TRLPBF 适用于需要高效能的场合,包含但不限于:

  • 电源管理: 适合用于开关电源、DC-DC 转换器,能够有效地提高转换效率,减少功耗。
  • 电机驱动: 在高功率电机驱动应用中,该 MOSFET 能够承受大电流,提供高输出来驱动电机。
  • 逆变器: 适用于太阳能逆变器等场合,能够确保稳定的电力转换。
  • 汽车应用: 由于其宽广的工作温度范围,该 MOSFET 适合于汽车电子产品,如电动助力转向系统和充电器。
  • 工业控制: 其高载流能力和耐高温特性,使得 IRFS3306TRLPBF 可以在严苛环境条件下的工业控制应用中表现优异。

4. 性能优势

  • 高效率: 由于其低 Rds On 值,在开关状态下可以显著降低损耗,提高系统的整体效率。
  • 耐高温: 该器件的工作温度范围可以支持-55°C至175°C的复杂环境,确保在不同气候和温度条件下可靠运行。
  • 高功率处理能力: 最大功率耗散达到230W,使其适合在大功率应用中使用,降低因功率损耗而导致的热问题。
  • 易于驱动: 较低的栅极电荷(Qg)和适中的阈值电压(Vgs(th))使得驱动电路设计变得简单,适合于多种控制策略。

5. 封装与散热

IRFS3306TRLPBF 采用 D2PAK 封装,这种封装形式不仅能有效减小电路布局面积,而且具有良好的散热性能,能够在高功率应用中保持器件的低温工作态。D2PAK 封装的设计使得散热片可以直接连接到 PCB 板,为大电流应用提供了必要的热管理。

6. 总结

综上所述,IRFS3306TRLPBF 是一款卓越的 N 通道 MOSFET,凭借其高电压、大电流、低导通阻抗和宽温工作范围,成为现代电力电子应用中的重要选择。用户可以依靠该器件在各类严苛环境下的出色表现,为系统提供稳定和高效的电力管理解决方案。无论是电源转换、电机控制还是工业自动化,IRFS3306TRLPBF 都是值得考虑的优质元器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.