WMSIC Electronic Components

Infineon IRF7465TRPBF

ModelIRF7465TRPBF
PackageSO-8
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRF7465TRPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRF7465TRPBF
Electronic Component
1
Package
SO-8
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.275g
Electronic Component
1
Electronic Component
BM0230495332
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.5W
Electronic Component
Electronic Component
Electronic Component
4000
Voltage(Vdss)
150V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:IRF7465TRPBF

基础信息

IRF7465TRPBF 是一款高性能的 N 沟道 MOSFET(场效应管)产品,采用先进的金属氧化物半导体技术,专为满足现代电力电子应用的需求而设计。该器件具有优异的电气性能和可靠性,适用于各种高压、高电流和高温环境下的应用。

主要参数

IRF7465TRPBF 的主要参数包括:漏源电压(Vdss)为 150V,能够承受较高的工作电压而不发生击穿。其连续漏极电流(Id)为 1.9A(在环境温度为 25°C 时),使其在多种应用场合具备良好的输送能力。此外,该器件的导通电阻(Rds(on))在 10V 驱动电压下为最大 280 毫欧,提供低压降和低功耗的运行特性,使其非常适合于高效能的设计。

在栅极驱动方面,IRF7465TRPBF 的栅极驱动电压(Vgs)最高可达 ±30V,确保能够实现高效的开关控制。其阈值电压(Vgs(th))最大值为 5.5V(@ 250µA),使得器件能够在较小的栅极电压下有效开启。此外,该器件的栅极电荷(Qg)最大值为 15nC(@ 10V),说明它在高频开关应用中的响应速度较快,有助于提高整体电路的效率。

功率和温度特性

IRF7465TRPBF 的功率耗散能力可达到最大 2.5W,这使得它在高负载条件下能够有效工作而不发生过热问题。工作温度范围广泛,从 -55°C 到 150°C,确保其在严苛环境下也能稳定运行,这一特性使其非常适合于汽车、电源管理、伺服驱动和其他工业应用。

封装与安装

该 MOSFET 采用 SO-8 表面贴装型封装,这种封装形式不仅节省了PCB空间,还便于高密度集成。SO-8 封装的设计确保了良好的散热性能和电气接口,适合现代电子设备的迷你化和轻量化发展的趋势。

应用领域

IRF7465TRPBF 非常适用于不同的应用场景,包括但不限于:

  1. 电源管理:在电源转换器和稳压器中,IRF7465TRPBF 可以作为主开关元件,确保高效的能量转换和低损耗。

  2. 电动汽车:在电动汽车驱动系统中,作为功率开关能够提供高效能以及高可靠性。

  3. 工业控制设备:可用于伺服驱动、变频器和其他自动化设备中,通过提供优越的开关性能和耐用性,提升设备的整体效率。

  4. 消费电子:在各类消费电子产品的电源管理模块中,IRF7465TRPBF 能够优化能耗,并延长设备的使用寿命。

总结

综合考虑,IRF7465TRPBF 是一款高效、可靠的 N 沟道 MOSFET,凭借其优异的电气特性、宽广的工作温度范围及紧凑的封装形式,广泛应用于各种电力电子领域。其适应性使得设计工程师能够在复杂的应用中发挥更多创意并满足日益增长的市场需求。作为英飞凌的产品,IRF7465TRPBF 受到市场的广泛认可,必将助力更多创新项目的成功实施。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.