WMSIC Electronic Components

Infineon BSS138NH6433XTMA1

ModelBSS138NH6433XTMA1
PackageSOT-23
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BSS138NH6433XTMA1
Type
INFINEON
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSS138NH6433XTMA1
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.019g
Electronic Component
1
Electronic Component
BM0228289626
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
360mW
Electronic Component
Electronic Component
Electronic Component
10000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS138NH6433XTMA1 产品概述

一、概述

BSS138NH6433XTMA1 是英飞凌(Infineon)出品的一款小功率 N 沟道场效应管(MOSFET),采用 SOT-23 封装,适用于空间受限的开关与信号控制场合。器件具有 60V 的最大耐压 (Vdss)、较低的导通电阻及小的栅极电荷,适合中低电流、开关频率适中的电路应用。

二、主要参数

  • 类型:N 沟道 MOSFET(单只)
  • 漏源电压 Vdss:60 V
  • 连续漏极电流 Id:230 mA
  • 导通电阻 RDS(on):3.5 Ω @ Vgs = 10 V
  • 最大耗散功率 Pd:360 mW
  • 阈值电压 Vgs(th):1.4 V @ ID = 26 µA
  • 总栅极电荷 Qg:1.4 nC @ Vgs = 10 V
  • 输入电容 Ciss:41 pF;输出电容 Coss:9.5 pF;反向传输电容 Crss:3.8 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23

三、特性与优势

  • 耐压较高:60V 的 Vdss 让该器件可应用于较高电压边沿的开关场合。
  • 小封装:SOT-23 体积小、适合集成在密集的 PCB 布局中。
  • 低栅极电荷与适中电容值:Qg = 1.4 nC 与 Ciss ≈ 41 pF,有利于在中等开关速度下减少驱动能耗与延时。
  • 宽温度范围:额定工作温度 -55 ℃ 到 +150 ℃,适用于工业级环境。

四、典型应用

  • 低功耗开关与负载控制(小电流继电器、LED 驱动与小电机驱动的控制回路)
  • 信号切换、水平/电平移位、接口保护电路
  • 电池供电设备与便携式电子产品中需要节省 PCB 空间的场合

五、设计与使用建议

  • RDS(on) 在 Vgs=10V 下给出为 3.5 Ω,门极阈值约 1.4 V,但并未给出在 4.5V 或 2.5V 下的 RDS(on),因此当以逻辑电平驱动(如 3.3V/5V)时,应在电路中验证实际导通损耗与温升。
  • 额定连续电流仅 230 mA 且功耗 360 mW,使用时需考虑结到环境的热阻与散热条件,避免长期高负载工作导致过热。
  • 对于开关电感性负载,建议并联合适的续流二极管或抑制网络以保护器件免受反向瞬态冲击。
  • 在紧凑 SOT-23 封装下,良好的 PCB 散热布局(加大铜箔面积、短走线)有助于提高可靠性与最大允许电流。
  • 若追求更低导通损耗或高频高效率切换,应考虑更低 RDS(on) 的器件或并联使用(但需留意分流不均)。

六、可靠性与注意事项

在长期或边界工况下使用时,应遵循最大额定值(Vdss、Id、Pd)并留有裕量,注意栅极静电防护与操作时的浪涌电压。SOT-23 封装物理尺寸较小,对焊接工艺与热循环较为敏感,建议遵循制造商的焊接与回流曲线规范。

七、结论

BSS138NH6433XTMA1 以其 60V 耐压、紧凑 SOT-23 封装和适中的驱动特性,适合用于空间受限、工作电压较高且电流需求不大的开关与信号控制场景。设计时应重视导通损耗与热管理,确认门极驱动电平下的实际性能,以确保长期可靠运行。

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