WMSIC Electronic Components

Infineon IRS2304STRPBF

ModelIRS2304STRPBF
PackageSOIC-8
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRS2304STRPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRS2304STRPBF
Electronic Component
1
Package
SOIC-8
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.45g
Electronic Component
1
Electronic Component
BM0000286940
Operating Temperature
40℃~+150℃
Operating Voltage
10V~20V
Load Type
IGBT;MOSFET
Driver
Electronic Component
Current(IOH)
60mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRS2304STRPBF 产品概述

概要

IRS2304STRPBF是英飞凌(Infineon)公司推出的一款高性能的栅极驱动集成电路,专为驱动IGBT和N沟道MOSFET设计。该器件整合了多个先进特性,广泛应用于电机驱动、变频器、开关电源以及其他需要高效功率转换和控制的电力电子系统中。器件的主要特点包括半桥驱动配置、独立通道驱动,以及高达600V的工作电压。

设计特点

  1. 驱动配置: 该产品采用半桥配置,适合于多种电气应用。这一配置使得IRS2304STRPBF能够以最小的复杂度实现对功率MOSFET和IGBT的高效驱动。

  2. 通道类型与驱动器数量: IRS2304STRPBF包含两个独立的驱动通道,用户可以独立控制任一通道,为电机驱动或逆变器等系统提供灵活的设计解决方案。

  3. 电压及电流特性: 它的供电电压范围为10V至20V,能够应对多种应用需求。同时,IRS2304STRPBF可提供高达600mA的上升电流和290mA的下降电流,这使得设备可以快速驱动高功率MOSFET,提升系统的整体效率和响应速度。

  4. 输入及状态逻辑: IRS2304STRPBF支持非反相的输入逻辑,具有明显的简便性。其逻辑电压特性(VIL为0.7V,VIH为2.3V)极大地降低了对控制电路的要求,确保模块能够在不同的工作环境中稳定运行。

  5. 自举功能: 器件在高压侧的最大电压可达600V,并具备自举功能,这使得它能够在高电压操作环境中保持良好的性能,是需求高电压驱动电路设计的理想选择。

  6. 高速切换: 该器件的上升时间和下降时间分别为70ns和35ns,这意味着它具有良好的动态响应能力。对于需要高频开关操作的应用,如变频器和高频逆变器,这一点尤为重要。

  7. 工作温度范围: IRS2304STRPBF的工作温度范围从-40°C到150°C,适合于严酷的工业环境以及高温应用,确保设备的可靠性和耐用性。

  8. 封装与安装类型: 该产品采用表面贴装型SOIC-8封装,其尺寸为0.154” (3.90mm宽),对于设计要求空间有限的电子设备,能够有效地节省PCB的占用面积。

应用场景

由于其优异的特性,IRS2304STRPBF适合于多种应用,包括但不限于:

  • 变频器和伺服电机驱动
  • 主动电源因数校正(PFC)电路
  • 高频开关电源
  • 动态电机控制
  • 高频逆变器应用
  • 工业自动化领域的控制系统

结论

IRS2304STRPBF以其紧凑的设计、宽广的输入、电压适应性以及快速的开关性能,成为现代功率电子应用中的一款关键核心元器件。凭借英飞凌强大的工程技术背景和长期承诺于产品的可靠性和高性能,IRS2304STRPBF无疑是电子工程师在设计高可靠性和高效能电源系统时的理想选择。无论是在瞬态动态响应还是在热管理方面,IRS2304STRPBF都表现出色,是您各种电力电子项目中不可或缺的组件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.