Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon TLE7259-3GE TLE7259
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Infineon TLE7259-3GE
- Type
- INFINEON
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- TLE7259-3GE
- Electronic Component
- 1
- Package
- DSO-8
- Type
- Transceiver
- Electronic Component
- LIN Transceiver
- Electronic Component
- 0.22g
- Electronic Component
- 1
- Features
- Bus;;;; TXD; Bus; Low Power
- Electronic Component
- BM0072941068
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 5.5V~27V
- Operating Current
- 5mA
- Receiver
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLE7259-3GE 产品概述
一、引言
TLE7259-3GE是由英飞凌（Infineon）推出的一款高性能LIN（Local Interconnect Network）收发器，专为在汽车和工业应用中提供可靠、高效的数据通信而设计。作为一款封装为PG-DSO-8的元器件，TLE7259-3GE不仅能够满足现代汽车对车载网络日益增长的要求，同时也适用于各种嵌入式应用。
二、产品特点
通信标准：TLE7259-3GE完全符合LIN 2.2A协议，能够支持多种LIN网络的应用，确保数据传输的高效和稳定。
低待机功耗：该收发器具有非常低的待机功耗，使得在不工作的时候能有效地减少能耗，延长设备的使用寿命。
高抗干扰能力：TLE7259-3GE具有优秀的抗干扰性能，使其在电磁干扰（EMI）环境中也能保持稳定的工作，确保通信的可靠性。
温度范围：设备能够在-40至+125摄氏度的宽范围内正常工作，符合汽车行业严格的温度要求，非常适合在恶劣环境条件下使用。
集成特性：集成了电源管理、过压和过温保护等功能，简化了外围电路设计，降低了系统的复杂性。
三、应用领域
TLE7259-3GE广泛应用于多个领域，尤其是汽车电子及工业自动化等场合。具体应用包括：
汽车电子：用于车载网络中各类模块之间的通信，如车身控制、动力系统、传感器数据传输等。
工业设备：在工业自动化设备中实现各个组件的信息交互，提高生产线的智能化水平。
智能家居：可用于智能家居系统中，实现各种家庭设备的相互通信，提升用户体验。
其他嵌入式应用：例如医疗设备、仪器仪表等领域，TLE7259-3GE亦能够有效地满足数据通信需求。
四、设计支持与工具
英飞凌为TLE7259-3GE提供了全面的设计支持，包括详细的规格说明书、应用笔记以及参考设计。用户可通过这些资源快速理解该产品的特性并进行设计。加之相应的开发工具和仿真软件，用户能够更高效地完成产品的开发和测试。
五、总结
TLE7259-3GE是一款性能卓越的LIN收发器，凭借其优异的通信性能、低功耗、高抗干扰能力和广泛的应用领域，成为现代电子应用中的重要元件。无论是在汽车、工业设备还是其他嵌入式应用中，TLE7259-3GE都能以其出色的性能和可靠性满足用户的各类需求。选择TLE7259-3GE，意味着为您的设计提供强有力的技术保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
