WMSIC Electronic Components

Infineon IRF7832TRPBF

ModelIRF7832TRPBF
PackageSO-8
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRF7832TRPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRF7832TRPBF
Electronic Component
1
Package
SO-8
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.286g
Electronic Component
1
Electronic Component
BM0000281005
Operating Temperature
55℃~+155℃
Power Dissipation(Pd)
2.5W
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:IRF7832TRPBF

引言

IRF7832TRPBF 是一款高性能的 N 沟道 MOSFET,专为需要高效率、高功率密度及可靠性的小型化电源管理系统而设计。其主要特点包括漏源电压(Vdss)高达 30V、连续漏极电流(Id)达到 20A,以及低导通电阻(Rds(on))仅为 4mΩ。这使得 IRF7832TRPBF 在各种应用场合中,如 DC-DC 转换器、马达驱动、负载开关等领域,展现出卓越的性能。

技术参数

IRF7832TRPBF 的主要技术参数如下:

  • 漏源电压 (Vdss): 30V,能够在30V的电压下稳定工作,是低至中压应用的理想选择。
  • 连续漏极电流 (Id): 20A(在 25°C 条件下),足以支持大多数需要高电流的负载。
  • 导通电阻 (Rds(on)): 在 10V 驱动电压下,4mΩ 的低导通电阻能够有效减少导通损耗,提升效率。
  • 栅源极阈值电压 (Vgs(th)): 2.32V @ 250µA,确保器件在低电压下就能启动,提高开关速度。
  • 最大功率耗散: 2.5W(在 25°C 环境下),为器件的可靠性和散热性能提供保障。
  • 驱动电压: 最大 Rds(on) 需要 4.5V,而 10V 可确保获得最小 Rds(on) 值,适用于多种驱动电压条件。
  • 栅极电荷 (Qg): 51nC @ 4.5V,这一参数确保了器件在高频应用中的响应速度。

封装与安装

IRF7832TRPBF 采用 8-SOIC(0.154"或3.90mm宽)封装,具有良好的散热性能和紧凑的设计,使其适合表面贴装(SMD)应用。该封装形式便于自动化生产和快速装配,大幅提高了工艺效率。

工作温度范围

IRF7832TRPBF 的工作温度范围从 -55°C 到 155°C,确保该器件能够在各种极端环境条件下稳定工作,适用于汽车、工业控制以及其他需要高温或低温环境下工作的设备。

应用场合

IRF7832TRPBF 是一款多用途的 MOSFET,广泛应用于如下领域:

  1. DC-DC 转换器:适用于高效的能量转换,确保更高的输出功率。
  2. 负载开关:在需要精确控制开关状态的应用中表现出色,特别是在便携式设备中。
  3. 电机驱动:能够有效控制电机的启停和速度,适孕于自动化设备、家用电器等。
  4. 照明控制:用于 LED 驱动和调光应用,保证卓越的能效和稳定的输出。
  5. 电源管理:在各种电源管理应用中提供可靠的性能,助力提高系统的整体效率。

总结

IRF7832TRPBF 是一款优异的 N 沟道 MOSFET,凭借其出色的电气性能及宽广的工作温度范围,在现代电子系统中扮演着举足轻重的角色。其低导通电阻和高速开关特性,使其在电源管理、灯光控制、马达驱动等领域有着广泛的应用前景。无论是在严格的工业环境还是严苛的汽车用途,IRF7832TRPBF 都能够为设计工程师提供可靠的解决方案,帮助其设计出高效、稳定且具有良好性能的电子产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.