Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon IRS2117STRPBF
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Infineon IRS2117STRPBF
- Type
- INFINEON
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- IRS2117STRPBF
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- (UVP)
- Electronic Component
- Gate Driver IC
- Electronic Component
- 0.169g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0265972309
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 10V~20V
- Load Type
- IGBT；MOSFET
- Driver
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRS2117STRPBF 产品概述
一、产品简介
IRS2117STRPBF 是英飞凌（Infineon）面向高压侧单通道功率器件的驱动器，专为 IGBT 和 MOSFET 门极驱动设计。工作电源范围宽（10V–20V），在严苛工作温度下仍能稳定驱动功率开关器件，封装为 SOIC-8，适合集成在中小功率逆变器、驱动模块及电源转换器中。
二、主要特性
- 驱动配置：高边驱动（High-side）
- 适用负载：IGBT / MOSFET
- 驱动通道数：1
- 灌电流（下拉，IOL）：600 mA
- 拉电流（上拉，IOH）：290 mA
- 工作电压（VCC）：10 V ~ 20 V
- 上升时间（tr）：约 75 ns，下降时间（tf）：约 35 ns
- 传播延迟：约 105 ns
- 工作结温范围：-40 ℃ ~ +150 ℃（Tj）
- 封装：SOIC-8，环保无铅（STRPBF）
三、性能优势
IRS2117STRPBF 输出驱动能力强，尤其在下拉侧提供高达600 mA 的灌电流，可快速将开关器件关闭，缩短关断时间并降低切换损耗。较快的上升/下降时间配合 105 ns 的传播延迟，使其在中高速开关场合表现良好。宽温度范围与高压耐受能力满足工业级应用需求。
四、典型应用
- 三相/单相逆变器与交流驱动器
- 电机驱动与伺服系统
- 开关电源（SMPS）与功率因数校正（PFC）
- 焊接机、电源测试设备及工业功率模块
五、设计注意事项
- 采用合适的栅极电阻以抑制振荡并控制 dv/dt，应根据器件寄生参数选择阻值。
- 注意布局：电源与接地回路短且粗，驱动与被驱动器件之间走线尽量短，减少环路电感。
- 在高频或高温工况下关注封装散热，可搭配散热铜箔或散热器改善热性能。
- 使用合适的旁路与引导电容（例如引导电容和旁路电容）以保证驱动电源稳定。
IRS2117STRPBF 以其稳健的驱动能力、宽工作电压与工业级温度规格，适合需要高可靠性与快速响应的功率电子系统。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
