WMSIC Electronic Components

Infineon IRS2093MTRPBF

ModelIRS2093MTRPBF
PackageMLPQ-48
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
Infineon IRS2093MTRPBF
Type
INFINEON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRS2093MTRPBF
Electronic Component
1
Package
MLPQ-48
Electronic Component
Audio Power Amplifier
Electronic Component
0.2g
Electronic Component
1
Features
Switch
Electronic Component
BM0230046946
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRS2093MTRPBF 产品概述

一、产品简介

IRS2093MTRPBF 是英飞凌(Infineon)系列的四通道 D 类放大器 IC,采用 MLPQ-48(7×7 mm)小型封装,面向空间受限且对效率与声音品质有较高要求的消费类与专业音频应用。器件集成了放大核心与必要的控制功能,便于实现紧凑的多声道音频放大模块。器件后缀 RPBF 表示符合无铅/环保焊料工艺要求,适用于现代电子产品的环保制造规范。

二、主要功能与特性

  • 四通道 D 类输出结构,支持常见的多声道输出拓扑(如 BTL 桥接输出),以提高输出功率密度与系统效率。
  • 使能/关断(Enable/Shutdown)控制:通过数字控制引脚快速进入工作或低功耗关断状态,便于系统电源管理与待机模式实现。
  • 自动静音/免噪音开关(Auto Mute / Click- and Pop Suppression):在开机、关机或突变信号期间自动抑制噪声,提升用户体验并降低扬声器发声突变。
  • 高效率、低待机损耗:D 类拓扑显著降低功耗与器件发热,适合便携或散热受限应用。
  • 小型封装与裸露散热垫:MLPQ-48 封装减小 PCB 占用空间,同时通过底部或顶部的散热焊盘实现热传导。

三、封装与引脚概览

IRS2093MTRPBF 采用 MLPQ-48(7×7 mm)封装,带有散热焊盘。典型引脚分布包括:电源输入、逻辑电源与地、四路音频输入、四路输出(或桥接输出端)、使能与静音控制引脚以及若干滤波/补偿引脚。设计时应重点关注散热焊盘的焊接与热通道设计,以保证器件可靠运行并延长寿命。

四、典型应用与优势

  • 适用于多声道家庭影院、电视内置音响、条形音箱(soundbar)、无线音箱与多扬声器便携系统。
  • 通过集成静音控制与高效 D 类结构,能在有限空间内实现较高音频输出功率同时保持低噪声。
  • 使能/关断特性便于系统快速响应与低功耗管理,适合智能终端或带有待机策略的设备。

五、设计注意事项与建议

  • 电源与去耦:在电源引脚附近放置低等效串联电阻(ESR)的旁路电容,减小电源回路阻抗,降低开关噪声回输。
  • PCB 布局:尽量缩短高电流回路(电源、输出负载)路径,采用分层地平面或星形地线,确保模拟/数字地分离并在单点汇合。
  • 散热处理:使用充足的焊盘焊点与过孔形成热通道,将热量引导至内层/底层散热铜箔。若工作在高功率点,考虑在板下加入散热片或风流。
  • EMI 与滤波:D 类开关输出对 EMI 敏感,必要时在输出端加 LC 滤波网络并优化拓扑与走线以满足电磁兼容要求。
  • 控制时序:遵循器件使能与静音的推荐时序,避免在未稳定电源情况下开启输出,从而减少 click/pop 现象。

六、总结

IRS2093MTRPBF 以其四通道输出、集成控制功能(使能/关断、自动静音/免噪音)和紧凑的 MLPQ-48 封装,为多声道音频系统提供了兼顾效率、音质与系统集成度的解决方案。合理的 PCB 布局与散热设计、充分的电源去耦及 EMI 控制,将有助于发挥器件的最佳性能并提高系统可靠性。若需进一步的电气参数、典型应用电路或布局范例,建议参考英飞凌官方数据手册和参考设计资料。

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