WMSIC Electronic Components

Infineon 1EDN8511B

Model1EDN8511B
PackageSOT-23-6
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon 1EDN8511B
Type
INFINEON
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
1EDN8511B
Electronic Component
1
Package
SOT-23-6
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
1.7g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0257590403
Operating Temperature
40℃~+150℃
Operating Voltage
4.5V~20V
Load Type
MOSFET
Driver
Electronic Component
Current(IOH)
4A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1EDN8511B 产品概述

一 产品简介

1EDN8511B 是英飞凌(Infineon)推出的一款单通道低边(low-side)MOSFET栅极驱动器,封装为 SOT-23-6。器件针对高速开关场合优化,能够在 4.5V 至 20V 的工作电源下驱动功率 MOSFET,适用于对开关速度和可靠性有要求的工业及汽车电子应用。

二 关键参数

  • 驱动配置:低边(Low-side)
  • 驱动通道数:1 通道(单通道)
  • 灌电流 (IOL):8 A(下拉/吸电流)
  • 拉电流 (IOH):4 A(上拉/源电流)
  • 工作电压:4.5V ~ 20V
  • 上升时间 tr:6.5 ns
  • 下降时间 tf:4.5 ns
  • 传播延迟 tpLH / tpHL:19 ns / 19 ns
  • 保护特性:欠压保护(UVP)
  • 工作结温范围:-40℃ ~ +150℃ (Tj)
  • 输入阈值:输入高电平 VIH ≈ 1.9V ~ 2.3V;输入低电平 VIL ≈ 0.8V ~ 1.2V
  • 封装:SOT-23-6

三 主要特性与优势

  • 高瞬态输出能力:8A 下拉与 4A 上拉能快速对 MOSFET 栅极充放电,减少开关损耗与开关过渡时间。
  • 快速响应:ns 级的上升/下降时间及约 19 ns 的传播延迟,适合高频开关环境。
  • 宽输入电源范围(4.5~20V):支持多种功率栅极电压配置。
  • 欠压保护(UVP):在栅极驱动电源不足时自动保护,提升系统可靠性。
  • 宽工作温度:支持高达 150℃ 的结温,适应严苛环境。

四 典型应用

  • 同步降压(synchronous buck)功率级低边开关驱动
  • 电机驱动与电源管理开关(工业与汽车电子)
  • 高亮度 LED 驱动与开关电源
  • 任何需要紧凑封装、高速驱动低边 MOSFET 的场合

五 设计与使用建议

  • 电源去耦:建议在 VCC 引脚附近放置低 ESR 陶瓷电容(如 100nF ~ 1µF)并尽量靠近器件管脚,以抑制瞬态电流尖峰。
  • 门极阻抗:为抑制振铃与限流,建议在驱动器与 MOSFET 栅极之间串联小电阻(一般为几个Ω,根据系统 EMI 与切换损耗权衡选择)。
  • 输入接口:确保 MCU 或逻辑电平输出满足 VIH/VIL 范围,避免不确定的门限状态。注意器件上拉能力低于下拉,驱动上沿与下沿的对称性需在电路设计时考虑。
  • 布局与散热:SOT-23-6 封装需良好铜箔散热,关键回路(VCC、GND、栅极回路)尽量缩短走线、加宽铜箔并使用过孔连接多层地平面,降低寄生电感。

六 选型注意与资料查询

在最终设计与量产前,请参阅英飞凌官方数据手册确认器件的绝对最大额定值、典型电气特性、热阻参数及详细引脚排列。对特殊应用(如高频高电流切换、汽车纵深可靠性)建议进行实际板级试验与热分析以验证性能。

以上为基于给定参数的 1EDN8511B 产品概述,若需引脚图、典型应用电路或与具体 MOSFET 的配合评估,可提供具体电路拓扑与元件型号以便进一步分析。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.