WMSIC Electronic Components

Infineon IRFS3107TRLPBF

ModelIRFS3107TRLPBF
PackageD2PAK
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRFS3107TRLPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRFS3107TRLPBF
Electronic Component
1
Package
D2PAK
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
1.73g
Electronic Component
1
Electronic Component
BM0227698185
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
370W
Electronic Component
Electronic Component
Electronic Component
800
Voltage(Vdss)
75V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRFS3107TRLPBF 产品概述

一、产品简介

IRFS3107TRLPBF 是英飞凌(Infineon)提供的一款高功率 N 沟增强型 MOSFET,采用 D2PAK 表面贴装封装,适用于中高电压、中大电流的开关与传导场合。器件的工作结温范围宽 (-55℃ ~ +175℃),并且为无铅可回流包装(TRLPBF),便于现代制造工艺的应用与可靠性要求。

二、主要参数(基础参数一览)

  • 类型:N 沟 MOSFET
  • 数量:1 个 N 沟
  • 漏源电压 Vdss:75 V
  • 连续漏极电流 Id:195 A
  • 最大耗散功率 Pd:370 W
  • 阈值电压 Vgs(th):4 V
  • 总栅极电荷 Qg:240 nC @ Vgs=10 V
  • 输入电容 Ciss:9.37 nF @ Vds=50 V
  • 工作结温 Tj:-55 ℃ ~ +175 ℃
  • 封装:D2PAK(TO-263 型表面贴装)
  • 品牌:Infineon(英飞凌)
    (注:更多详尽参数如 Rds(on)、漏极-源极电流脉冲能力、封装热阻等请参考完整数据手册。)

三、器件特点与优势

  • 75 V 的耐压等级覆盖常见的 12 V/24 V/48 V 等车辆与工业系统,能应对开关瞬态与负载变化。
  • 极高的连续漏极电流能力(195 A)适合大电流开关与低压大电流母线应用,如同步整流、DC–DC 降压主开关或负载切换。
  • 较高的耗散功率(370 W)结合 D2PAK 导热路径,可在优秀散热管理下实现高功率工作。
  • 宽温度范围(高达 175 ℃)提升了在高温恶劣环境下的可靠性与寿命。

四、驱动与开关特性注意事项

  • 虽然器件阈值电压 Vgs(th) 为 4 V,但这仅为导通开始点,远不能确保低 Rds(on)。建议栅极驱动电压采用 10 V(或器件数据手册推荐值)以获得较低导通电阻与较好导通损耗。
  • 总栅极电荷 Qg=240 nC(@10 V)和 Ciss=9.37 nF 表明栅极电容较大,驱动器需要提供足够的峰值电流以实现快速开关。高 Qg 会带来较大的开关损耗与驱动能耗,在高频开关场合需特别考虑驱动器能力与效率平衡。
  • 建议在栅极串联适当的阻尼电阻(例如 5–22 Ω,根据布局和振铃情况调整)以抑制振铃并控制开关过冲,同时在需要时并联栅极-源电阻进行上电状态控制。

五、热管理与 PCB 布局建议

  • D2PAK 通过大面积铜箔与焊盘实现热量传导,须确保器件底部与散热层的良好接触。推荐在 PCB 下方及背面增加铜铺设和多层过孔以提高热扩散能力。
  • 在高电流路径上采用宽而短的铜走线,尽量减小电阻与寄生电感,保证稳健的电流传输并降低热耗散点。
  • 保持栅极驱动回路最短、环路面积最小化;源极到驱动器地的回流应为独立、低阻路径。
  • 对于含有快速换向或高 dv/dt 场景,需考虑 TVS、RC 缓冲器或钳位电路以保护器件免受瞬态冲击。

六、典型应用场景

  • 同步整流与大电流 DC–DC 降压转换器(服务器、通信电源)
  • 电机驱动(工业伺服、步进或直流电机驱动)
  • 汽车电子(48 V 母线管理、电机驱动与负载开关)
  • 功率开关与逆变器前端(UPS、工业电源)
  • 高电流负载开关与电子断路器

七、选型建议与注意事项

  • 在选型时除核对 Vdss、Id、Pd 外,务必参考数据手册中的 Rds(on)、脉冲电流规格与 SOA(安全工作区)曲线,以确认在目标工况下的损耗与热阻匹配。
  • 对于开关频率较高的应用,应评估开关损耗(由 Qg 与 Ciss 带来)与导通损耗的综合影响,必要时可考虑并联多只 MOSFET 或使用更低 Qg 的替代型号。
  • 系统设计中加入合适的保护电路(电流检测、过温关断、浪涌抑制)以延长器件寿命并提高可靠性。

八、总结

IRFS3107TRLPBF 是一款面向中高电压与大电流应用的功率 MOSFET,凭借 75 V 耐压、195 A 连续电流和 370 W 的耗散能力,适合需要高功率密度和可靠性的工业与汽车场合。其较大的栅极电荷与输入电容要求驱动器具备足够能力并重视 PCB 热管理与布局设计。最终的系统表现仍依赖于对数据手册中详细电气参数和热特性的综合评估,建议结合应用工况做完整的热仿真与损耗估算。

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