WMSIC Electronic Components

Infineon IRFR6215TRLPBF

ModelIRFR6215TRLPBF
PackageDPAK(TO-252AA)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon IRFR6215TRLPBF
Type
INFINEON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRFR6215TRLPBF
Electronic Component
1
Package
DPAK(TO-252AA)
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.38g
Electronic Component
1
Electronic Component
BM0230046940
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
110W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
150V
Capacitor(Ciss)
860pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRFR6215TRLPBF 产品概述

一、产品简介

IRFR6215TRLPBF 是英飞凌(Infineon)系列中一款单个 P 沟道场效应管(MOSFET),额定漏源电压 150V,连续漏极电流 13A,封装为 DPAK(TO-252AA)。器件设计用于高压高功率开关场合,具有耐高温(-55℃ 到 +175℃)和较高耗散能力(Pd = 110W)的特点,适合工业与功率管理类应用。

二、主要参数(概要)

  • 沟道类型:P 沟道,数量:1 个
  • 漏源电压 Vdss:150V
  • 连续漏极电流 Id:13A
  • 导通电阻 RDS(on):295 mΩ @ Vgs = 10V(测试电流 6.6A)
  • 耗散功率 Pd:110W(器件极限,实际散热依赖 PCB/散热方案)
  • 总栅极电荷 Qg:66 nC(用于估算驱动能量与开关损耗)
  • 输入电容 Ciss:860 pF;反向传输电容 Crss:130 pF @ 120V
  • 工作温度范围:-55℃ ~ +175℃
  • 封装:DPAK (TO-252AA)

三、性能亮点

  • 高电压等级(150V),适合中到高压系统的高侧开关或保护电路。
  • P 沟道便于实现高侧开关(源接正电源,门极拉低导通),在简单门驱动下可提高系统简洁性。
  • 中等 RDS(on) 与较低 Ciss 组合,适合中频开关应用,功率与效率在设计合适散热时表现良好。
  • 宽温度工作范围适合苛刻工业环境。

四、应用场景

  • 电源管理与负载开关(高侧开关)
  • 工业与通信设备的保护和断电控制
  • 逆变/整流电路中的辅助开关或隔离开关
  • 需要在较高电压下实现简单门驱动的场合

五、驱动与热设计建议

  • 作为 P 沟道器件,门极必须相对于源极施加负偏压才能导通;设计时注意门-源电压极限(请以厂商完整数据手册为准,常见器件 Vgs 绝对值约 ±20V)。
  • Qg = 66 nC,属于中等栅极电荷,建议使用能够提供瞬时峰值电流的门极驱动(0.5–2 A 峰值)以获得较快切换,降低开关损耗。
  • Crss = 130 pF 在高 dv/dt 时会产生明显米勒效应,需在驱动和布局中考虑以防误触发或增加开关损耗。
  • 虽然标称 Pd = 110W,但 DPAK 的实际散热依赖 PCB 铜箔面积、热过孔与散热器。高速大电流工作必须铺大面积散热铜箔并使用多层 PCB 热通道或外部散热方案。

六、使用与可靠性注意事项

  • 严格遵循数据手册的绝对最大额定值(特别是 Vgs、Vds、Id 和功耗)以避免器件损伤。
  • 焊接与回流工艺按 DPAK 推荐曲线进行,控制封装温度与时间以保证可靠性。
  • 防静电保护(ESD)与正确存储(避免潮湿)有助于提高良率与长期可靠性。
  • 在并联使用或替代 N 沟道器件时,应评估 RDS(on)、门极驱动方式及热均衡问题。

七、总结

IRFR6215TRLPBF 为一款面向高压高侧开关与电源管理的 P 沟道 MOSFET,凭借 150V 耐压、13A 连续电流能力和 110W 耗散能力,在需要简化高侧驱动的场合具有明显优势。设计时需重视栅极驱动能力、米勒效应抑制与合理散热布局,以发挥器件的最佳性能。欲了解详细极限参数与典型波形,请参阅英飞凌完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.