WMSIC Electronic Components

Infineon IRFR9024NTRLPBF

ModelIRFR9024NTRLPBF
PackageTO-252-3(DPAK)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon IRFR9024NTRLPBF
Type
INFINEON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRFR9024NTRLPBF
Electronic Component
1
Package
TO-252-3(DPAK)
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.45g
Electronic Component
1
Electronic Component
BM0058402735
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
38W
Gate Voltage(Vgs)
±20V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRFR9024NTRLPBF 产品概述

一、产品简介

IRFR9024NTRLPBF 是一颗单通道 P 沟道功率 MOSFET,封装为 TO-252-3(DPAK),由 Infineon(英飞凌)系列供应。器件适用于中低压开关场合,额定漏源电压 55V,连续漏极电流 11A,在良好散热条件下器件最大功耗约 38W(视器件工作点与散热条件而定)。器件工作结温范围宽 (-55℃ ~ +150℃),适合工业与汽车类苛刻环境使用。

二、主要性能参数

  • 漏源电压 Vdss:55 V
  • 连续漏极电流 Id:11 A
  • 导通电阻 RDS(on):175 mΩ @ VGS = 10 V, ID = 6.6 A
  • 阈值电压 Vgs(th):约 4 V(以幅值表示,P 沟道器件阈值为负值,常以 |Vgs(th)| 给出)
  • 总栅极电荷 Qg:19 nC @ VGS = 10 V
  • 输入电容 Ciss:350 pF @ 25 V
  • 工作结温:-55℃ ~ +150℃ (Tj)
  • 封装:TO-252-3 (DPAK),表面贴装,方便自动化贴装与回流焊工艺

三、典型应用场景

  • 高侧开关/负载断开(12V/24V 系统中的正电源开关)
  • 电池保护与反接保护电路(需结合限流与热保护)
  • DC-DC 转换器的辅助开关或半桥应用(对开关损耗与驱动要求适中)
  • 工业控制与汽车电子中的功率开关元件

四、驱动与开关建议

  • P 沟道器件需对栅极施加相对于源极的负压以导通;例如在 12V 母线下将栅拉至 0V 可得到 VGS ≈ -12V,从而完全导通。注意器件给出的 RDS(on) 为在 VGS = 10 V 条件下测得的值,实际使用时注意 VGS 的极性与幅值。
  • 总栅极电荷 Qg = 19 nC 表明门极驱动电流需求中等,驱动器应能提供足够电流以控制开关速度;为抑制振铃并控制电磁干扰,建议在栅极串联小阻(典型 10–100 Ω,根据开关速度与损耗权衡选择)。
  • 输入电容 Ciss = 350 pF,配合 Qg,可用于估算驱动器所需峰值电流及上升/下降时间。

五、散热与封装注意

  • DPAK(TO-252-3)为表面贴装功率封装,散热依赖 PCB 铜箔面积与热过孔。为发挥器件最大电流能力,应在焊盘下与底层提供足够铜面积并使用多热过孔以导出热量。
  • 在没有大面积散热的条件下,应对额定电流进行降额处理,确认结-壳与结-环境热阻并计算结温上升,保证长期可靠性。

六、设计与可靠性要点

  • 注意 VGS 最大额定值与栅极电压极性,避免超过器件最大绝对额定值导致击穿。
  • 在感性负载或快速开关场合,增加 RC 吸收或 TVS 保护以抑制瞬态电压,保护器件免受过压与应力。
  • 在板级布局上尽量缩短电流回路、减小寄生电感,并保证良好的地与电源分流路径。
  • 若用于汽车或工业环境,请考虑热循环、振动与浪涌电压的应力测试与器件降额策略。

总结:IRFR9024NTRLPBF 在中低压(最高 55V)且需 P 沟道高侧控制的场合表现平衡,具有适中的导通电阻与门极电荷,适合做简单高侧开关或负载断开器件。设计时重点关注栅极驱动、散热布局与瞬态保护以获得最佳性能与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.