WMSIC Electronic Components

Infineon IKD10N60RATMA1

ModelIKD10N60RATMA1
PackageTO-252-3(DPAK)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon IKD10N60RATMA1
Type
INFINEON
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IKD10N60RATMA1
Electronic Component
1
Package
TO-252-3(DPAK)
Electronic Component
IGBT / Module
Electronic Component
0g
Electronic Component
1
IGBT Type
Electronic Component
Electronic Component
BM0228667355
Type
Surface Mount
Operating Temperature
40°C ~ 175°C(TJ)
Switch
210µJ, 380µJ
Gate
64nC
Electronic Component
400V, 10A, 23, 15V
Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IKD10N60RATMA1 产品概述

一、产品简介

IKD10N60RATMA1 是英飞凌推出的一款沟槽型场截止(Trench Field‑Stop)IGBT,额定集电极-发射极击穿电压 600V,最大连续集电极电流 20A,封装为表面贴装的 TO‑252‑3 (DPAK)。器件针对中高压、开关频率适中且需要较低导通损耗的功率转换应用进行了优化。

二、主要电气参数

  • 集电极-发射极击穿电压 VCES = 600V(最大)
  • 最大连续集电极电流 Ic = 20A,脉冲峰值 Icm = 30A
  • 导通电阻/导通压降:VCE(on) = 2.1V @ VGE=15V、IC=10A(典型测试条件)
  • 总门极电荷 QG ≈ 64nC(标准输入型驱动特性)
  • 开/关能量(测试条件 400V、10A、23Ω、VGE=15V):Eon ≈ 210µJ,Eoff ≈ 380µJ
  • 开/关延迟(25°C):Td(on) ≈ 14ns,Td(off) ≈ 192ns
  • 工作结温范围:TJ = -40°C ~ +175°C
  • 最大功耗 Ptot = 150W(器件级)

三、封装与热管理

TO‑252‑3 (DPAK) 表面贴装便于自动化组装,但散热能力受限于 PCB 铜箔面积与焊盘设计。建议在 PCB 底层设计大面积散热铜箔并通过多层过孔导通至散热层;在器件附近留出合适的焊盘与热通道以降低结-壳温升,必要时配合散热片或加强板级冷却。

四、应用场景

适用于逆变器驱动、电机控制、电源开关、功率因数校正(PFC)以及其他 400V 级别的中功率开关场合。沟槽场截止结构在降低导通损耗的同时保持良好的开关特性,适合对效率与热设计有要求的系统。

五、设计与驱动建议

  • 建议工作门极电压以 15V 为基准驱动,避免超过器件规定的 VGE 最高限值(请参考数据手册)。
  • 由于器件 QG ≈ 64nC,驱动器需具备足够的峰值驱动能力;可采用 10Ω~47Ω 的门极电阻起始值,根据 EMI 与开关应力调优。
  • Eoff 较 Eon 大,关断能量相对较高,实际系统中应配置缓冲/钳位电路(RC 吸收、主动斩波或瞬态抑制)以降低开关应力与电压尖峰。
  • 布局上注意最短的功率回流路径、低感抗的电源与接地回路,以及在门极与发射极之间增加旁路电容以抑制高速开关引起的 Miller 效应和电压耦合。
  • 并联使用时需谨慎考虑电流共享与热分布,推荐进行实验验证并采取均流/限流措施。

六、可靠性与选型提示

器件支持高达 175°C 的结温上限,但长期可靠运行仍需按应用场景进行热仿真与退化裕度设计。选型时应结合最大工作电压、电流脉冲特性与系统开关频率,综合评估导通损耗与开关损耗,以确定是否需要采用散热强化或更低 VCE(on) 的器件。

总结:IKD10N60RATMA1 在 600V/20A 区间提供了较低的导通压降与较好的开关性能,适合中等功率的开关应用。合理的门极驱动、PCB 散热设计与开关应力管理是发挥其性能与延长寿命的关键。若需更详尽的电气特性、SOA 或封装机械图,请参阅英飞凌的完整数据手册。

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