WMSIC Electronic Components

Infineon BSS306NH6327XTSA1

ModelBSS306NH6327XTSA1
PackageSOT-23-3
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon BSS306NH6327XTSA1
Type
INFINEON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSS306NH6327XTSA1
Electronic Component
1
Package
SOT-23-3
Electronic Component
MOSFET
Electronic Component
MOSFET
Electronic Component
0.185g
Electronic Component
1
FET Type
N
Electronic Component
BM0000744694
Type
Surface Mount
Operating Temperature
55°C ~ 150°C(TJ)
Package / Housing
TO-236-3,SC-59,SOT-23-3
Vgs
±20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS306NH6327XTSA1 产品概述

概述

BSS306NH6327XTSA1 是 Infineon Technologies 旗下的一款高性能小信号 N 通道 MOSFET,采用 SOT-23-3 封装。这款 MOSFET 设计用于满足汽车及工业应用的高质量要求,并提供极佳的耐用性和可靠性。其广泛的应用场景包括 LED 照明、先进驾驶辅助系统(ADAS)、车身控制单元、开关模式电源(SMPS)以及电机控制等。

基本参数

BSS306NH6327XTSA1 的漏源电压(Vdss)为 30V,适应多种工作环境。它的最大连续漏极电流(Id)为 2.3A,在 25°C 的工作温度下表现出色。驱动电压方面,最大 Rds On 在 4.5V 和 10V 条件下有良好表现,使其在低电压驱动时同样具有低导通电阻(Rds On)。在 10V 时,导通电阻的最大值为 57 毫欧,确保低电能损耗,提高整体电路效率。

电气特性

BSS306NH6327XTSA1 的阈值电压(Vgs(th))的最大值为 2V(在 11µA 测试条件下),这意味着它在非常低的驱动电压下即可实现导通。这一特性使得该 MOSFET 特别适合于低功耗应用。同时,其栅极电荷(Qg)最大值为 1.5nC(在 5V 条件下),使得电路在高频开关操作下更为高效。

输入电容(Ciss)的最大值为 275pF(在 15V 条件下),有助于改善开关速度,以满足快速切换需求。这些电气特性相结合,使 BSS306NH6327XTSA1 在各种高频应用中表现卓越。

热性能与功耗

BSS306NH6327XTSA1 的功率耗散最大值为 500mW,适应 -55°C 到 150°C 的工作温度范围。这种宽广的温度范围为器件在严酷环境下的应用提供了保障,特别是在汽车和工业控制系统中。其高功率处理能力与低导通损耗相结合,确保在高负载条件下的可靠性。

封装与安装

采用 SOT-23-3 封装,BSS306NH6327XTSA1 的体积小、重量轻,适合于空间受限的应用,同时也简化了在现代电路板上的设计。表面贴装型的安装方式使得其在自动化生产中更为便捷,提高了生产效率。

应用领域

BSS306NH6327XTSA1 可广泛应用于多种领域,特别适合于汽车电子和工业控制系统。其中,它在 LED 照明、车身控制单元以及开关电源等领域具有重要作用。对于那些需要高可靠性、低功耗和快速响应的电子设备,BSS306NH6327XTSA1 是一个理想的解决方案。

总结

综上所述,BSS306NH6327XTSA1 是一款高性能的小信号 N 通道 MOSFET,具有出色的电气特性和广泛的应用潜力。无论是在汽车电子还是工业自动化领域,这款 MOSFET 都能满足用户的各种需求。其优越的性能、可靠性和适用性使其成为现代电子设备的重要组成部分,为实现高效、安全的电子控制系统提供了强大的支持。选择 BSS306NH6327XTSA1,意味着选择了可靠性与技术的完美结合。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.