WMSIC Electronic Components

Infineon BGA524N6E6329XTSA1

ModelBGA524N6E6329XTSA1
PackageTSNP-6
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BGA524N6E6329XTSA1
Type
INFINEON
Minimum package
12000

Technical parameters

IP3
4dBm
P1dB
12dBm
Electronic Component
INFINEON
Electronic Component
BGA524N6E6329XTSA1
Electronic Component
19.6dB
Electronic Component
1
Package
TSNP-6
Electronic Component
RFAmplifier
Electronic Component
0.17g
Frequency
1.55GHz~1.615GHz
Electronic Component
1
Features
Low Power
Electronic Component
BM0228272442
Noise Figure
0.55dB
Operating Temperature
40℃~+85℃
Operating Voltage
1.5V~3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BGA524N6E6329XTSA1 产品概述

一、简介

BGA524N6E6329XTSA1 是英飞凌(Infineon)面向全球导航卫星系统(GNSS)前端的低噪声放大器(LNA),工作频段覆盖 1.55 GHz 至 1.615 GHz,特别适配 GPS / Galileo 等 L1/E1 频段接收器。该器件在极低功耗下提供高增益与优异的噪声性能,适合对灵敏度要求高且对体积、功耗敏感的终端设备。

二、主要性能指标

  • 工作频段:1.55 GHz ~ 1.615 GHz
  • 增益(典型值):19.6 dB
  • 噪声系数(NF):0.55 dB
  • 工作电压:1.5 V ~ 3.3 V
  • 工作电流:2.5 mA(典型)
  • 1 dB 压缩点(P1dB):-12 dBm
  • 三阶截点(IP3):-4 dBm
  • 输入回波损耗(S11):11 dB
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:TSNP-6
  • 品牌:Infineon(英飞凌)

这些参数表明该器件是一个高增益、极低噪声、超低功耗的接收前端放大器,专为弱信号接收环境优化。

三、产品优势

  • 极低噪声系数(0.55 dB):显著提升接收机灵敏度,对微弱卫星信号捕获能力强。
  • 高增益(≈19.6 dB):可在前端提供足够的增益,降低后级接收器噪声贡献,改善信噪比。
  • 宽工作电压范围与超低功耗:1.5–3.3 V 工作电压、2.5 mA 电流,非常适合电池供电和便携设备。
  • 小尺寸封装:TSNP-6 便于在空间受限的模块中集成。
  • 工业级温度范围:-40 至 +85 ℃ 满足多种环境应用需求。

四、典型应用场景

  • 消费级与工业级 GPS / GNSS 模块
  • 可穿戴定位设备与手持导航仪
  • 车载定位与汽车电子(导航、远程信息处理)
  • 无人机(UAV)与精确定位平台
  • 物联网资产追踪器与定位终端
    该器件适合作为天线与后端接收器之间的第一级放大器,实现对弱卫星信号的放大与前端噪声控制。

五、设计与使用建议

  • 偏置与去耦:在 VCC 引脚附近放置高品质旁路电容(如 100 nF / 1 µF)以抑制电源噪声。遵循厂商推荐的偏置网络以保证稳定工作。
  • 射频接口:器件输入回波损耗约 11 dB,说明输入匹配较好;在板级设计中仍应保持输入、输出走线尽量短且直,使用适当的微带或带状线阻抗控制。建议在 RF 线上设置 DC 阻断电容和必要的 ESD/过载保护器件。
  • 线性与保护:P1dB 为 -12 dBm、IP3 为 -4 dBm,线性度有限,因此应避免在高功率发射环境(如同板高功率发射器工作时)直接暴露于高信号电平,建议在发射期间通过 RF 开关隔离或在天线端加入功率限幅保护。
  • 热与可靠性:器件功耗低,但在高温或封装密集的 PCB 上仍需保证良好散热及可靠接地,地平面连续且在器件周围布置足够过孔以改善 RF 地连接。
  • 调试与验证:在样机阶段进行 S-参数(S11/S21)、噪声系数与增益测试以验证板级匹配与性能,必要时通过小范围匹配网络微调。

六、环境与可靠性

BGA524N6E6329XTSA1 提供工业级工作温度范围(-40 ℃ 至 +85 ℃),并采用稳健的 TSNP-6 封装,便于自动贴装与回流焊工艺。建议在量产前参考英飞凌器件的详细数据手册与封装指南,遵循存储、回流焊曲线及 ESD 防护要求,以保证长期可靠性与一致性。

总结:BGA524N6E6329XTSA1 是一款面向 GNSS 前端的高性能低噪声放大器,凭借极低的噪声系数、高增益和超低功耗特性,特别适合对灵敏度与功耗有严格要求的定位终端与小型化模块应用。在系统设计中注意线性保护与合理的偏置与封装工艺,可发挥其最佳性能。若需进一步的电路接法、典型参考设计或数据手册,请参阅英飞凌官方技术文档。

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