Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon BSC028N06NS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Infineon BSC028N06NS
- Type
- INFINEON
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BSC028N06NS
- Electronic Component
- 1
- Package
- TDSON-8(5x6)
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.11g
- Electronic Component
- 1
- Electronic Component
- BM0000280562
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 83W
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BSC028N06NS MOSFET
概述
BSC028N06NS 是一款由英飞凌（Infineon）生产的N沟道场效应管（MOSFET），具有卓越的电性能，广泛应用于各类电源管理和开关电源设计中。这款MOSFET具有高电流承载能力和低导通电阻，旨在实现高效的功率转换和热管理。
主要参数
- 功率范围：最大功率为2.5W
- 电压范围：耐压高达60V
- 电流能力：最大漏电流为23A
- 封装类型：PG-TDSON-8，采用紧凑型的5x6mm封装设计，适应空间有限的电路板设计
- 结温范围：一般工作温度范围为-55℃至+150℃，适合多种应用场景
电气特性
BSC028N06NS 的关键性能指标如下：
- 低导通电阻（RDS(on)）：在接适当的栅极驱动电压后，该MOSFET的导通电阻非常低，这降低了在高电流下的功率损耗，显著提高了能效。
- 快速开关速度：该MOSFET具备快速的开关响应能力，有助于提高开关电源的功率因数，减少开关损耗。
应用领域
BSC028N06NS广泛应用于以下领域：
- DC-DC转换器：常用于降压和升压转换器中，作为主开关或同步整流器，提升转换效率。
- 电机驱动：在电机控制应用中，MOSFET可以用于驱动电机的开关，以实现高效和精确的控制。
- 电源管理：适合用于移动设备和便携式设备的电源管理模块，能够提供稳定的电压和电流输出。
- LED驱动：在LED驱动电路中，以控制LED流过的电流，提升亮度并延长寿命。
设计优势
- 小型封装：PG-TDSON-8 封装设计令其体积小巧，便于集成到新一代高密度电路板中。
- 高效性能：该MOSFET采用先进的工艺技术，具有较低的导通电阻和优异的开关特性，可以大幅提高功率转换的效率，减少能量浪费。
- 可靠性：英飞凌的产品以高可靠性著称，BSC028N06NS经过严格的测试，确保能够在苛刻环境中稳定工作。
热管理
由于高电流和高功率密度的特性，BSC028N06NS的热管理至关重要。在实际电路设计中，合理的散热方案，如使用散热片或热传导设计，可以有效降低MOSFET的工作温度，延长元件的使用寿命。
结论
总之，BSC028N06NS MOSFET是一款高性能、高可靠性的电子元器件，适用于各种先进的电源管理和开关电源应用。它不仅在紧凑的封装中提供强大的功能，还具备出色的导电性和热管理性能，是现代电子产品设计中不可或缺的关键组件之一。通过使用BSC028N06NS，设计师可以有效提升产品性能，实现更高效的电能转换，满足不断增长的市场需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
