Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon IPD900P06NM
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon IPD900P06NM
- Type
- INFINEON
- Minimum package
- 2500 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- IPD900P06NM
- Electronic Component
- 1
- Package
- TO-252-3
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.41g
- Electronic Component
- 1
- Electronic Component
- BM0228685653
- Operating Temperature
- 55℃~+175℃
- Power Dissipation(Pd)
- 63W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage(Vdss)
- 60V
- Capacitor(Ciss)
- 1.1nF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IPD900P06NM 产品概述
一、概述
IPD900P06NM 是英飞凌（Infineon）推出的一款 P 沟道功率 MOSFET，额定漏源电压 60V，适用于中低压高侧开关与功率管理场合。器件采用 TO-252-3（DPAK）表面贴装封装，兼顾热性能与可制造性，单片数量：1 个 P 沟道。
二、主要性能参数
- Vdss（漏源电压）：60V
- RDS(on)（导通电阻）：90 mΩ @ VGS = 10V, Id = 16.4A
- 连续漏极电流 Id：12.7A（受热与封装限制的连续电流能力）
- 总栅极电荷 Qg：27 nC @ VGS = 10V（影响开关损耗与驱动需求）
- 输入电容 Ciss：1.1 nF @ 30V；反向传输电容 Crss：39 pF @ 30V
- 功耗 Pd：63W（器件额定耗散，需配合散热设计）
三、开关与驱动要点
栅极电荷 27 nC 表明开关过程需要合适的驱动能力。举例：若要求 20 ns 的开通斜率，驱动电流峰值约为 Qg/t ≈ 1.35 A；驱动损耗约为 Pdrive = Qg·Vdrive·fs，即在 100 kHz 时约为 27 mW（Vdrive = 10V）。Ciss 对开关能量影响为 E ≈ 0.5·Ciss·V^2 ≈ 55 nJ/次，可用于估算转换损耗。
四、热性能与封装
TO-252-3（DPAK）提供较好的热路径，适合贴片焊接在铜箔较大的散热焊盘上以降低结-壳、结-环境热阻。器件额定耗散 63W 为理想条件（低结温、良好散热）下的值，实际应用中需根据 PCB 面积、通孔与散热层做热仿真与布局。
五、典型应用
- 中低压高侧负载开关与电源管理（如电池供电系统高侧断开）
- 便携设备或汽车电子中的反接保护与电源路径选择（需注意温度与可靠性要求）
- 线性或开关调节器中的负载开关单元（低频或中频应用更为合适）
六、选型与使用建议
- 确认 VGS 驱动电压与控制逻辑匹配（推荐 10V 驱动以达到标称 RDS(on)）
- 根据最大工作电流计算导通损耗 Pcond = I^2·RDS(on)，例如在 12.7A 时约 14.5W，需评估散热能力；短脉冲允许峰值更高但受封装限值约束
- 优化 PCB 布局：减小源引线阻抗，增强散热铜箔，靠近驱动 IC 布置以减少寄生电感与 ringing
- 若用于开关频率较高的场合，关注 Qg 与 Crss 导致的开关损耗与电磁干扰，必要时使用缓冲或阻尼网络
总结：IPD900P06NM 集中体现了在 60V 级别下 P 沟道 MOSFET 的平衡性能——适合中等电流、高侧开关与电源管理用途。设计时应结合实际热设计与驱动能力，确保器件在额定条件下稳定工作。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
